Bo-Young Kim1,Subin Jo1,Jihoon Kim2,Seong Dae Park1,Myong Jae Yoo1,Hyunseung Yang1
Korea Electronics Technology Institute1,Kongju National University2
Bo-Young Kim1,Subin Jo1,Jihoon Kim2,Seong Dae Park1,Myong Jae Yoo1,Hyunseung Yang1
Korea Electronics Technology Institute1,Kongju National University2
The acrylic resin has excellent mechanical and optical properties because it is simple to control the optical properties due to the molecular structure and forms 3-dimensional network structures after photocuring. In addition, the photocuring process has advantages of reducing process time because the curing time is shorter than thermal curing. Recently, the direct printing method using acrylate inks has been applied to manufacturing the printed circuit board for electric devices. [K1] After the manufacturing of circuit using acrylic ink, the chemical process such as etching is performed; for this reason, adhesion properties between ink layer and substrate become a very important factor in manufacturing the printed circuit board. In the case of acrylate inks, the crosslinking density is determined by the type and amount the photoinitiators, the contents of the monomer and oligomer, the UV irradiation time and intensity. In this study, acrylate inks are prepared by varying the type and amount of the photoinitiators, the photo curing behavior and the adhesion properties of acrylate inks[K2] . We confirmed that the photocrosslinking density of the acrylic ink increased as the photoinitiator content increased, also increased the adhesion to the substrate. Finally, acrylic inks with excellent adhesion and etching and stripping was prepared.