Stephen Forrest1,Rebecca Lentz1,Byungjun Lee1,jihun lim1,Dejiu Fan1,Bosun Roy-Layinde1,Tobias Burger1,Andrej Lenert1
University of Michigan1
Stephen Forrest1,Rebecca Lentz1,Byungjun Lee1,jihun lim1,Dejiu Fan1,Bosun Roy-Layinde1,Tobias Burger1,Andrej Lenert1
University of Michigan1
The combination of non-destructive epitaxial liftoff and cold weld bonding of III-V materials developed in our laboratory has opened the way to realizing a variety of thin film inorganic semiconductor devices that can serve applications that have heretofore not been accessible to conventional semiconductors.(Lee et al., 2014) For example, we have demonstrated devices as diverse as cylindrical and hemispherical imagers (the latter of which that undergo a topological transformation during fabrication),(Fan et al., 2019) and more recently, extremely high efficiency thermal photovoltaics that employ exceptionally long air-bridges where the very thin active semiconductor is suspended between gold pillars.(Fan et al., 2020) More recently, we have demonstrated air-bridge TPVs in Si to obtain more favorable economics for this important renewable energy storage application. In this talk we will discuss advances and state of the art in thin film electronics, considering current applications and prospects for the future.<br/><br/>Fan, D., Burger, T., McSherry, S., Lee, B., Lenert, A. J. & Forrest, S. R. 2020. Nearly perfect photon utilization in an air-bridge thermophotovoltaic cell. <i>Nature,</i> 586<b>,</b> 237.<br/>Fan, D., Lee, B., Coburn, C. & Forrest, S. R. 2019. From 2D to 3D: Strain-and elongation-free topological transformations of optoelectronic circuits. <i>Proc. National Academy of Sciences</i><b>,</b> 201813001.<br/>Lee, K., Zimmerman, J. D., Hughes, T. W. & Forrest, S. R. 2014. Non-Destructive Wafer Recycling for Low-Cost Thin-Film Flexible Optoelectronics. <i>Adv. Functional Mater.,</i> 24<b>,</b> 4284.