Hybrid, Compliant Implantable and Wearable Neural Systems

The introduction of soft materials and microtechnology provides an opportunity to tailor the design of neural transducers and explore interfaces with increased selectivity and improved biointegration. Soft carrier materials and elasticity engineering support neural devices with mechanical signature closer to that of the neural host tissue and potential for long-term biointegration. Microfabrication allows for customized electrode layouts with micrometric to millimetric electrode diameter, low to high (0.1 to &gt;10 /mm²) electrode density and small to large (mm² to 10s cm²) surface area. Hybrid integration of conventional, rigid electronic hardware with the compliant neural transducers is explored to enable on-board signal processing, data transfer and powering. The design and processing of multilayered thin-film encapsulation are then required to hermetically package the thin form-factor neural systems.<br/>This talk will review our advances in each of the four components, namely soft transducers, integrated LEDs, hybrid interfacing with customized electronics and telemetry and flexible yet hermetic organic-inorganic multilayers. We will illustrate these concepts with neural systems interfacing the central nervous system.