MRS Meetings and Events

 

EL07.08.05 2023 MRS Fall Meeting

High-Mobility Flexible Transistors with Low-Temperature Solution-Processed Tungsten Dichalcogenides

When and Where

Nov 29, 2023
4:00pm - 4:15pm

Hynes, Level 3, Ballroom B

Presenter

Co-Author(s)

Tian Carey1,Oran Cassidy1,Kevin Synnatschke1,Eoin Caffrey1,James Garcia1,Shixin Liu1,Harneet Kaur1,Adam Kelly1,Jose Munuera1,Cian Gabbett1,Domhnall O’Suilleabhain1,Jonathan Coleman1

Trinity College Dublin1

Abstract

Tian Carey1,Oran Cassidy1,Kevin Synnatschke1,Eoin Caffrey1,James Garcia1,Shixin Liu1,Harneet Kaur1,Adam Kelly1,Jose Munuera1,Cian Gabbett1,Domhnall O’Suilleabhain1,Jonathan Coleman1

Trinity College Dublin1
Solution-processed electronic inks with two-dimensional (2D) materials have the potential to enable the next generation of low-cost printed digital electronics. [1] Here we will present the advances in fabricating printed complementary inverters achieving a voltage gain |<i>A</i><sub>v</sub>| ≈ 0.1 with liquid phase exfoliated (LPE) flakes and discuss the limitations of the technology. [2] The electrochemical exfoliation of large-aspect-ratio (&gt;100) semiconducting flakes of tungsten diselenide (WSe<sub>2</sub>) and tungsten disulfide (WS<sub>2</sub>) as well as molybdenum disulfide (MoS<sub>2</sub>) will be necessary to create a library of high-mobility solution-processed networks that conform to substrates, remain functional over thousands of bending cycles and can be utilised in complementary solution-processed circuits.<br/><br/>We will present the use of Langmuir–Schaefer coating to achieve highly aligned and conformal flake networks of flakes, with minimal mesoporosity (∼2–5%), at low processing temperatures (120 °C) and without acid treatments. [3] Our processing enables the fabrication of state-of-the-art flexible transistors in ambient air, achieving average mobilities μ &gt; 10 cm<sup>2 </sup>V<sup>–1</sup> s<sup>–1</sup>, with a current on/off ratio of I<sub>on</sub>/I<sub>off</sub> ≈ 10<sup>3</sup> - 10<sup>4</sup>. [3] We will also demonstrate subthreshold slopes as low as 182 mV/dec, essential for maintaining power efficiency and examine the performance of our WSe<sub>2</sub> transistors after 1000 bending cycles at 1% strain.[3] Additionally, we will demonstrate air-stable, low voltage (&lt;5 V) operation of inkjet-printed CMOS with MoS<sub>2</sub>, with a voltage gain above unity |<i>A</i><sub>v</sub>| ≈ 1.4. [4] The results represent a critical enabling step towards ubiquitous long-term stable, low-cost solution-processed digital integrated circuits.[4]<br/><br/>[1] Torrisi, F. & Carey, T. Graphene, related two-dimensional crystals and hybrid systems for printed and wearable electronics. <i>Nano Today</i> <b>23</b>, 73-96 (2018).<br/>[2] Carey, T. <i>et al</i>. Fully inkjet-printed two-dimensional material field-effect heterojunctions for wearable and textile electronics. <i>Nature Communications</i> <b>8</b>, 1202 (2017).<br/>[3] Carey, T. <i>et al</i>. High-Mobility Flexible Transistors with Low-Temperature Solution-Processed Tungsten Dichalcogenides, <i>ACS Nano</i>, 17, 3, 2912–2922 (2023).<br/>[4] Carey, T. <i>et al</i>. Inkjet Printed Circuits with 2D Semiconductor Inks for High-Performance Electronics. <i>Advanced Electronic Materials</i> <b>7</b>, 2100112 (2021).

Keywords

ink-jet printing

Symposium Organizers

Gabriela Borin Barin, Empa
Shengxi Huang, Rice University
Yuxuan Cosmi Lin, TSMC Technology Inc
Lain-Jong Li, The University of Hong Kong

Symposium Support

Silver
Montana Instruments

Bronze
Oxford Instruments WITec
PicoQuant
Raith America, Inc.

Publishing Alliance

MRS publishes with Springer Nature