3D Nanoprinting of Functional Crystalline Materials

Can 3D printing become an innovative strategy for manufacturing electronic and photonic integrated circuits? A key prerequisite is to acquire high-quality crystalline functional materials that are 3D printable at the nanoscale. Here, we present our solvent-engineering-assisted 3D printing method that enables freeform, nanoscale structuring of diverse crystalline materials. The method exploits a femtoliter ink meniscus to guide material crystallization in three dimensions with the aid of in-situ solvent engineering, fabricating freestanding nanostructures with programmed shape, composition, and crystallinity. This scheme has pioneered new 3D printing materials that can be used for integrating electronic and photonic circuits, including metal halide perovskites [1-3], peptides [4,5], metal-organic frameworks [6], and nanoparticle clusters [7]. Successful demonstrations of 3D-printed real devices such as bright nano-displays [8], lasers, anticounterfeiting labels [2,3], biosensors [7], and micro-thermometers [9] have proven the practicality of our method. In this talk, I will discuss our experimental/theoretical studies on how to develop the nanoscale 3D printing method, and the prospects of our work for potential applications in IC (integrated circuit) manufacturing.<br/><br/>References<br/>[1] Chen M., Yang J., Wang Z., Xu Z., Lee H., Lee H., Feng S.-P., Pyo J, Seol S.K., Kim J.T.*, Advanced Materials 31, 1904073 (2019)<br/>[2] Chen M., Hu S., Zhou Z., Huang N., Lee S., Zhang Y., Cheng R., Yang J., Xu Z., Liu Y., Lee H., Huan X., Feng S.-P., Shum H.C., Chan B.P., Seol S.K., Pyo J.*, Kim J.T.*, Nano Letters 21, 5186 (2021)<br/>[3] Chen M., Zhou Z., Hu S., Huang N., Lee H., Liu Y., Yang J., Huan X., Xu Z., Cao S., Cheng X., Wang T., Yu S.F., Chan B.P., Tang J., Feng S.-P.*, Kim J.T.*, Advanced Functional Materials 33, 2212146 (2023)<br/>[4] Yang J., Huan X., Liu Y., Lee H., Chen M., Hu S., Cao S., Kim. J.T.*, Nano Letters 22, 7776 (2022)<br/>[5] Yang J., Chen M., Lee H., Xu Z., Zhou Z. Feng S.-P., Kim J.T.*, ACS Applied Materials & Interfaces 13, 20573 (2021)<br/>[6] Liu Y., Yang J., Tao C., Lee H., Chen M., Xu Z., Peng H., Huan X., Li J., Cheng X.*, Kim J.T.*, ACS Applied Materials & Interfaces 14, 7184 (2022)<br/>[7] Kim W.-G., Lee J.-M., Yang Y.,Kim H., Devaraj V., Kim M., Jeong H., Choi E.-J., Yang J., Jang Y., Badloe T., Lee D., Rho J.*, Kim J.T.*, Oh J.-W.*, Nano Letters 22, 4702 (2022)<br/>[8] Bae J., Lee S., Ahn J., Kim J.H., Wajahat M., Chang W.S., Yoon S.-Y., Kim J.T., Seol S.K., Pyo J.*, ACS Nano 14, 10993 (2020)<br/>[9] Lee H., Wang Z., Rao Q., Lee S., Huan X., Liu Y., Yang J., Chen M., Ki D.-K.*, Kim J.T.*, Advanced Materials (published online) https://doi.org/10.1002/adma.202301704