Kyu-Hang Lee1,Tae-Wook Kim1,Ye-Jin Jin1,Soo-Min Lee1,Gye-Young Jo1,Kyu-Hoon Lee1,Young-Hwan Jeon2,Weon-Chae Seo3,Byung-Koo Son1
Cheorwon Plasma Research Institute1,AMOGREENTECH2,AMOTECH3
Kyu-Hang Lee1,Tae-Wook Kim1,Ye-Jin Jin1,Soo-Min Lee1,Gye-Young Jo1,Kyu-Hoon Lee1,Young-Hwan Jeon2,Weon-Chae Seo3,Byung-Koo Son1
Cheorwon Plasma Research Institute1,AMOGREENTECH2,AMOTECH3
With the miniaturization and multifunctionalization of electronic devices,MLCC (Multilayer Ceramic Capacitor), which is used as a passive element, is also required to be miniaturized and high-capacity.For this reason, thinning technology of Cu termination is becoming important. In this study, we synthesized nano glass frit powders of 150 nm or less to apply to MLCC 1005 size products and used these nano glass frit powders to manufacture paste.The characteristics of the manufactured paste were evaluated after the Cu termination was applied. Nano-size glass frit powders have been synthesized by DC (Direct Current) thermal plasma. A micro-sized glass frit powders powder was fed in the DC thermal plasma. In the high temperature of DC thermal plasma that is of higher than 6,000 K, the glass frit powder was vaporized. The size of produced glass frit particle can be controlled by the working power, the flow of working gas and quenching gas, the process pressure in a reactor and the feeding ration of raw materials. In this study, the conditions for producing nano glass frit powder with a size of 150 nm or less were set to 60 kW for DC power, 80, 100, 120 lpm for working gas flow, 50, 100 lpm for quenching gas flow, 300 torr for process pressure, and 300 g/hr for feeding rate.The produced nano glass powder was produced in paste using high pressure homogenizer and 3-roll-milling equipment. The manufactured paste was dipping and blotting simultaneously through dipping equipment to manufacture Cu termination. Nano glass frit powders that were less than 150 nm in diameter were observed morphology and the paste and Cu termination were observed by morphology, melting temperature and density.<br/><br/>Acknowledgement<br/>This work was supported by the Technology development Program(S3176611) funded by the Ministry of SMEs and Startups(MSS, Korea)