MRS Meetings and Events

 

EQ07.11.01 2022 MRS Fall Meeting

3659 V 0.37 A/mm NO2-Doped P-Channel Diamond MOSFETs Fabricated on Diamond Grown on Misoriented Sapphire Substrates

When and Where

Nov 30, 2022
1:30pm - 1:45pm

Sheraton, 2nd Floor, Independence East

Presenter

Co-Author(s)

Makoto Kasu1,Niloy Saha1,Seong Kim2,Koji Koyama2,Toshiyuki Oishi1

Saga University1,Adamant Namiki Precision Jewel Co., Ltd.2

Abstract

Makoto Kasu1,Niloy Saha1,Seong Kim2,Koji Koyama2,Toshiyuki Oishi1

Saga University1,Adamant Namiki Precision Jewel Co., Ltd.2
Diamond is an ultra-wide-gap semiconductor for prospective high-power and high-frequency transistors, because it possesses high bandgap energy of 5.47 eV and a breakdown field of &gt;10 MV/cm. A 1-inch-diameter diamond wafers were grown on (11-20) sapphire just substrate without cracking using the micro-needle technique [1]. Very recently, we have demonstrated a 2-inch-diameter (001) diamond wafer without cracking by using a misoriented (11-20) sapphire substrate. The diamond wafer showed the highest crystal quality; the lowest XRC FWHM of 98 arcsec and low dislocation density of 1~2 × 10<sup>7</sup> cm<sup>-2 </sup>[2]. In this study, we fabricated a NO<sub>2</sub>-doped p-channel diamond MOSFETs on a high-quality misoriented diamond substrate, which showed the highest breakdown voltages of 3659 V among diamond FETs.<br/>We used a (001) diamond as a substrate which was grown on a misoriented (11-20) sapphire substrate by 5<sup>o</sup> toward the [0001] c-direction. The H-terminated diamond substrate was exposed to 2% NO<sub>2</sub> gas diluted in N<sub>2</sub> to perform NO<sub>2</sub> p-type doing. After forming Au ohmic contact, 16-nm-thick Al<sub>2</sub>O<sub>3</sub> bi-layer was deposited as a gate insulator layer, and Au gate was formed with a gate length (L<sub>G</sub>) of 2 µm with gate-to-drain distance (L<sub>GD</sub>) varied from 12 µm to 50 µm. Finally, the diamond p-channel was passivated with 16-nm-thick Al<sub>2</sub>O<sub>3</sub> bi-layer.<br/>The DC output characteristics of a MOSFET showed a maximum drain current of 372 mA/mm. The gate leakage current was &lt;10<sup>-4</sup> mA/mm and an on/off ratio was determined as 10<sup>7</sup>. The on-resistance was 98.3 Ωmm and transconductance was obtained as 81 mS/mm at V<sub>GS</sub> of -3 V. The threshold voltage was 4.1 V indicative of normally-ON operation. The maximum field-effect mobility was estimated as 134 cm<sup>2</sup>/Vs. The maximum off-state breakdown voltage reached 3659 V, which is the highest for diamond FETs.<br/>[1] S.-W. Kim, Y. Kawamata, R. Takaya, K. Koyama, and M. Kasu, Appl. Phys. Lett. <b>117</b>, 202102 (2020).<br/>[2] S.-W. Kim, R. Takaya, S. Hirano and M. Kasu, Appl. Phys. Express <b>14</b> 115501 (2021).

Keywords

diamond

Symposium Organizers

Anke Krueger, Stuttgart University
Philippe Bergonzo, Seki Diamond Systems
Chia-Liang Cheng, National Dong Hwa University
Mariko Suzuki, University of Cádiz

Symposium Support

Silver
MUEGGE GmbH
Seki Diamond Systems

Bronze
Applied Diamond, Inc.
EDP Corporation
Fine Abrasives Taiwan CO., LTD.
Fraunhofer USA, Inc.
Qnami AG

Publishing Alliance

MRS publishes with Springer Nature