Meetings & Events

 

2007 MRS Spring Meeting Logo2007 MRS Spring Meeting & Exhibit


April 9-13, 2007
| San Francisco
Meeting Chairs: Timothy J. Bunning, Harold Y. Hwang, Debra Kaiser, Jennifer A. Lewis

Symposium E : Pb-Free and RoHS-Compliant Materials and Processes for Microelectronics

2007-04-11   Show All Abstracts

Symposium Organizers

Carol A. Handwerker Purdue University
Katsuaki Suganuma Osaka University
Heidi L. Reynolds Sun Microsystems, Inc.
Jasbir Bath Solectron Corporation
E1: Global RoHS and Environmental Regulations
Session Chairs
Jasbir Bath
Carol Handwerker
Wednesday AM, April 11, 2007
Room 3005 (Moscone West)

9:30 AM - **E1.1
Environmental Regulations and Materials Technology in the Electronics Industry

Robert Pfahl 1
1 , International Electronics Manufacturing Inititiative-iNEMI, Herndon, Virginia, United States

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10:00 AM - **E1.2
Management Methods for Controlling Pollution by Electronic Information Products - China RoHS.

David Towne 1
1 , Sun Microsystems, Inc., Menlo Park, California, United States

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10:30 AM - **E1.3
The Greening of Printed Electronics: Novel Materials Selection for Low-Cost Electronics in a RoHS World

Paul Brazis 1 , Jie Zhang 1
1 , Motorola, Inc., Schaumburg, Illinois, United States

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11:00 AM -
BREAK

11:30 AM - **E1.4
Quantifying Brominated Flame Retardant Content and Emissions in Polymers

Inez Hua 1 2 , Yin Ming Kuo 1 , Brianna Dorie 1
1 School of Civil Engineering, Purdue University, West Lafayette, Indiana, United States, 2 Division of Environmental and Ecological Engienering, Purdue University, West Lafayette, Indiana, United States

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12:00 PM - E1.5
Bromine Flame Retardant Interactions and Degradation with Gold-Aluminum Wire Bonds

John Osenbach 1 , Joze Antol 1 , Ron Weachock 1 , Carl Peridier 1 , Matt Stahley Stahley 1 , Frank Baiocchi Baiocchi 1 , John DeLucca DeLucca 1 , Dan Gerlach 1
1 , Agere systems, Allentwon , Pennsylvania, United States

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12:15 PM - E1.6
Zn-Sn and Zn-In High Temperature Lead-Free Solders

Katsuaki Suganuma 1 , Jae-Ean Lee 1 , Keun-Soo Kim 1
1 ISIR, Osaka Univ., Ibaraki, Osaka Japan

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12:30 PM - E1.7
e-Ni/Au UBM & AuSn Solder Bumping Technology for High Temperature LED Applications

Andrew Strandjord 1
1 , FlipChip International, Phoenix, Arizona, United States

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E2: Tin Whisker Nucleation and Growth
Session Chairs
Heidi Reynolds
Wednesday PM, April 11, 2007
Room 3005 (Moscone West)

2:30 PM - **E2.1
Sn whisker: Understanding and Prevention?

John Osenbach 1
1 , Agere systems, Allentwon , Pennsylvania, United States

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3:00 PM - **E2.2
An Electrical Characterization of Tin Whiskers

Robert Hilty 1 , Ned Corman 1
1 Technology, Tyco Electronics, Harrisburg, Pennsylvania, United States

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3:30 PM -
BREAK

4:00 PM - **E2.3
Sn Whisker Formation: Stress Generation at the Sn-Cu Interface.

Gery Stafford 1 , Carlos Beauchamp 1 , Ugo Bertocci 1 , Espen Sandnes 1 , William Boettinger 1
1 Metallurgy Division, NIST, Gaithersburg, Maryland, United States

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4:30 PM - **E2.4
Interaction of Stress, Intermetallic Formation and Defect Kinetics in Sn Whisker Formation.

Eric Chason 1 , Lucine Reinbold 1 , Nitin Jadhav 1 , Vernorris Kelly 1 , Jae Wook Shin 1 , Eric Buchovecky 1 , Ramanarayan Hariharaputran 1 , Sharvan Kumar 1
1 Division of Engineering, Brown University, Providence, Rhode Island, United States

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5:00 PM - E2.5
Distribution and evolution of stress in Sn layers on Cu

Nitin Jadhav 1 , Lucine Reinbold 1 , Vernorris Kelly 1 , Jae Wook Shin 1 , Anthony Johnson 1 , Michael Task 1 , Sharvan Kumar 1 , Eric Chason 1
1 , Brown University, Providence, Rhode Island, United States

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5:15 PM - E2.6
Characterization and Modeling of Intermetallic Growth Kinetics in Sn Layers on Cu.

Eric Buchovecky 1 , Lucine Reinbold 1 , Ramanarayan Hariharaputran 1 , Eric Chason 1 , Sharvan Kumar 1
1 Division of Engineering, Brown University, Providence, Rhode Island, United States

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5:30 PM - *
Next Steps:

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E3: Poster Session: Pb-Free and RoHS-Compliant Materials and Processes
Session Chairs
Jasbir Bath
Carol Handwerker
Heidi Reynolds
Katsuaki Suganuma
Wednesday PM, April 11, 2007
Salon Level (Marriott)

9:00 PM - E3.1
Dissolution Kinetics of Nickel in Lead-free Sn-Bi-In-Zn-Sb Soldering Alloys

Katayun Barmak 1 , David Berry 1 , Vira Khoruzha 2 , Kostyantyn Meleshevich 2 , Vasyl Dybkov 2
1 Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania, United States, 2 Department of Physical Chemistry of Inorganic Materials, Institute for Problems of Materials Science, Kyiv Ukraine

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9:00 PM - E3.10
Electrodeposition Process and Solder Characteristics of the Pb-free Composite Solder Reinforced with Carbon Nanotubes

Kwang-Yong Lee 1 , Eun-Kyoung Choi 1 , Tae-Sung Oh 1
1 Materials Science and Engineering, Hongik University, Seoul Korea (the Republic of)

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9:00 PM - E3.2
Growth Kinetics of the Intermetallic Layer at the Interface of Solid Metals with Liquid Soldering Alloys

Vasyl Dybkov 1
1 Department of Physical Chemistry of Inorganic Materials, Institute for Problems of Materials Science, Kyiv Ukraine

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9:00 PM - E3.3
Fabrication and Characterization of 0.95(Na0.5K0.5)NbO3-0.05LiTaO3 Piezoelectric Ceramics by Pressureless Sintering.

Min-Soo Kim 1 , Sin-Woong Kim 2 , Soon-Jong Jeong 1 , Bok-ki Min 1 , Jae-Sung Song 1
1 Advanced Materials & Application Research Laboratory, Korea Electrotechnology Research Institute, Changwon, Kyungnam, Korea (the Republic of), 2 Department of Ceramic Science and Engineering, Changwon University, Changwon, Kyungnam, Korea (the Republic of)

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9:00 PM - E3.4
Pulsed Laser Deposition of ferroelectric NaNbO3 Thin Films on MgO substrate.

Shinya Oda 1 , Takehisa Saito 1 , Takahiro Wada 1 , Hideaki Adachi 2
1 Materials Chemistry, Ryukoku University, Otsu, Shiga, Japan, 2 Advanced Technology Research Laboratories, Matsushita Electric Ind. Co., Ltd., Kyoto Japan

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9:00 PM - E3.5
First-Principles Calculation of Lead-Free Piezoelectric (K0.5Bi0.5)TiO3

Tomoyuki Koyama 1 , Akio Shigemi 1 , Takahiro Wada 1
1 Materials Chemistry, Ryukoku University, Otsu, Shiga, Japan

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9:00 PM - E3.6
The Study of the Organic Residue Influence on the Crystal Structure of Ge Nanoparticles

Suk Jun Kim 1 , Eric Stach 1 , Carol Handwerker 1 , Ling-Shao Chang 2 , Alexander Wei 2
1 Materials Engineering, Purdue University, West Lafayette, Indiana, United States, 2 Chemistry, Purdue University, West Lafayette, Indiana, United States

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9:00 PM - E3.7
Electrochemical Migration Mechanism of SnPb and Pb-free Solder alloys for PCBs.

YoungRan Yoo 1 , JaYoung Jung 1 , ShinBok Lee 2 , YoungBae Park 1 , YoungChang Joo 2 , YoungSik Kim 1
1 School of Advanced Materials Engineering, Andong National University, Andong, Gyeongbuk, Korea (the Republic of), 2 School of Materials Science and Engineering, Seoul National University, Seoul Korea (the Republic of)

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9:00 PM - E3.8
Dielectric Properties of Barium (Strontium) Titanate/ Polybenzoxazine Composites with 0-3 Connectivity for Electrical Applications

Gasidit Panomsuwan 1 , Hathaikarn Manuspiya 1 , Hatsuo Ishida 2
1 Petroleum and petrochemical, Chulalongkorn university, Bangkok Thailand, 2 Macromolecular Science and Engineering, Case Western Reserve University, Cleveland, Ohio, United States

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9:00 PM - E3.9
Microstructures and Dielectric Properties ofCu-deficient and excess CaCu3Ti4O12 Polycrystalline Ceramics

Sung Yun Lee 1 , Duk Keun Yoo 1 , Sang Im Yoo 1
1 School of Materials Science and Engineering, Seoul National University, Seoul Korea (the Republic of)

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2007-04-12   Show All Abstracts

Symposium Organizers

Carol A. Handwerker Purdue University
Katsuaki Suganuma Osaka University
Heidi L. Reynolds Sun Microsystems, Inc.
Jasbir Bath Solectron Corporation
E4: Pb-Free Solder: Materials and Properties
Session Chairs
Jasbir Bath
Katsuaki Suganuma
Thursday AM, April 12, 2007
Room 3005 (Moscone West)

9:30 AM - E4.1
Applications of Nanoindentation in the Evaluation of Mechanical Properties and Reliability of Sn-Ag-Cu Solders

Babak Arfaei 1 , Junghyun Cho 1
1 Mechanical Engineering Department, State University of New York at Binghamton, Binghamton, New York, United States

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9:45 AM - **E4.2
Stress Relaxation of SAC During the Dwell Period of a Thermal Cycle.

Milos Dusek 1 , Davide Maio 1 , Christopher Hunt 1
1 DEPC, NPL, Teddington, Middlesex, United Kingdom

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10:15 AM - E4.3
Thermal and TEM analysis of Sn Nano-Particles for Use in Nanosolder Applications

Kevin Grossklaus 1 , Eric Stach 1 , Carol Handwerker 1
1 Materials Science and Engineering, Purdue University, West Lafayette, Indiana, United States

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10:30 AM - E4.4
Intermetallic Compounds and Voids Formation in Pb-free Solders on Different Metallizations.

Zhiheng Huang 1 , Paul Conway 1 , Luke Taplin 1
1 Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough United Kingdom

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10:45 AM -
BREAK

11:15 AM - E4.5
Effects of Stress and Strain on Void Growth in Cu3Sn.

Mao Gao 1 , Liang Yin 2 , Pericles Kondos 2 , Peter Borgesen 2 , Eric Cotts 1
1 Physics and Materials Science, Binghamton University - SUNY, Binghamton, New York, United States, 2 , Unovis Solutions, Kirkwood, New York, United States

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11:30 AM - **E4.6
Correlation of Microstructure and Heterogeneous Failure in Pb Free Solder Joints.

Thomas Bieler 2 , Peter Borgesen 3 , Yan Xing 1 , Lawrence Lehman 1 , Eric Cotts 1
2 Materials Science and Chemical Engineering, Michigan State University, Lansing, Michigan, United States, 3 , Unovis Solutions, Kirkwood, New York, United States, 1 Physics and Materials Science, Binghamton University - SUNY, Binghamton, New York, United States

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12:00 PM - E4.7
Development of Simple Electrolytes for the Electrodeposition of Pb-free, Sn-based Alloy Solder Films.

Chunfen Han 1 , Qi Liu 1 , Douglas Ivey 1
1 Chemical and Materials Engineering, University of Alberta, Edmonton, Alberta, Canada

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12:15 PM - E4.8
Electromigration Study of SnAgBi and SnAgBiIn Systems Pb-free Solders.

Albert T Wu 1 , Ming-Shun Chen 1 , Wen-Lin Shih 1
1 Materials and Mineral Resources Engineering, National Taipei University of Technology, Taipei City Taiwan

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12:30 PM - E4.9
Lead-Free Solder Alloys With Small Amounts of Ni, Au and Cu

Chi-man Wu 1 , Ning Zhao 2 1 , Daquan Yu 2 , Lai Wang 2 , Joseph Lai 1
1 Physics and Materials Science, City University of Hong Kong, Hong Kong, Hong Kong SAR, China, 2 School of Materials Science and Engineering, Dalian University of Technology, Dalian, LiaoNing, China

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E5: Next Generation RoHS-Compliant Materials and Processes
Session Chairs
Carol Handwerker
Katsuaki Suganuma
Thursday PM, April 12, 2007
Room 3005 (Moscone West)

2:30 PM - E5.1
Characterisation of Ferroelectric Domains in KNN

Ralf-Peter Herber 1 , Susanne Wagner 1 , Michael Hoffmann 1 , Gerold Schneider 1
1 Institute of Advanced Ceramics, Hamburg University of Technology, Hamburg, Hamburg, Germany

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2:45 PM - E5.2
Deposition and Dielectric Response of CaCu3Ti4O12 Thin and Thick Films for High Energy Density Dielectric Applications.

Jennifer Sigman 1 , Paul Clem 1 , David Williams 1 , Michael Niehaus 1 , Diana Moore 1 , Bruce Tuttle 1
1 , Sandia National Laboratories, Albuquerque, New Mexico, United States

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3:00 PM - E5.3
BaxSr1-xTiO3 Single Crystal Fibers Grown by LHPG Technique and their Dielectric Properties.

Hathaikarn Manuspiya 1 , Ruyan Guo 2 , Amar Bhalla 2
1 petroleum and petrochemical college, Chulalongkorn university, Bangkok Thailand, 2 Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania, United States

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3:15 PM - E5.4
Structural and Diffusivity Study of Ba0.9Sr0.1ZrxTi1-xO3 Ceramics Prepared by Sol Gel Method.

Manoj Kumar 1 , Asish Garg 1
1 Department of physics , IIT Delhi, India, New delhi India

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3:30 PM -
BREAK

4:00 PM - E5.5
Development of Organic Stabilizers for Being Used in an Electroless Nickel Plating Bath.

Ke Wang 1 , Liang Hong 1 2 , Zhaolin Liu 2
1 Chemical & Biomolecular Engineering, National University of Singapore, Singapore Singapore, 2 , National University of Singapore, Singapore Singapore

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4:15 PM - E5.6
Lead-free Zero Stress Optic Glass.

Josef Zwanziger 1 2
1 Chemistry, Dalhousie University, Halifax, Nova Scotia, Canada, 2 Institute for Research in Materials, Dalhousie University, Halifax, Nova Scotia, Canada

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