Meetings & Events

 

2007 MRS Spring Meeting Logo2007 MRS Spring Meeting & Exhibit


April 9-13, 2007
| San Francisco
Meeting Chairs: Timothy J. Bunning, Harold Y. Hwang, Debra Kaiser, Jennifer A. Lewis

Symposium D : Deposition on Nonplanar Substrates

2007-04-10   Show All Abstracts

Symposium Organizers

Daniel Josell National Institute of Standards and Technology
Michael Brett University of Alberta
Christian Witt AMD c/o IBM T. J. Watson Research Center
Mikko Ritala University of Helsinki
D1/AA1: Joint Session: Fabricating and Filling Complex 3-d Structures
Session Chairs
Paul Braun
Daniel Josell
Tuesday AM, April 10, 2007
Room 3003 (Moscone West)

9:30 AM - **D1.1/AA1.1
Electrodeposition Through Colloidal Templates: Fabrication of Nanostructures, Properties and Applications.

Philip Bartlett 1
1 Chemistry, Southampton University, Southampton, Hampshire, United Kingdom

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10:00 AM - D1.2/AA1.2
Variable Filling Fraction Inverse Opal Metallic Photonic Crystals

Xindi Yu 1 , Yun-Ju Lee 1 , Robert Furstenberg 2 , Jeffrey White 2 , Paul Braun 1
1 Material Science and Engineering, University of Illinois, Urbana, Illinois, United States, 2 Physics, University of Illinois at Urbana Champaign, Urbana, Illinois, United States

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10:15 AM - **D1.3/AA1.3
Surface Engineering of Aerogels via Atomic Layer Deposition

Juergen Biener 1
1 Nanoscale Synthesis and Characterization Laboratory, Lawrence Livermore National Laboratory, Livermore, California, United States

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10:45 AM - *
Break

11:15 AM - **D1.4/AA1.4
New Routes to Three-Dimensional Photonic Band-Gap Materials

Martin Hermatschweiler 1 , Sean Wong 2 , Alexandra Ledermann 2 , Geoffrey Ozin 4 , Martin Wegener 1 2 3 , Georg von Freymann 1 2 3
1 Institut für Angewandte Physik, Universität Karlsruhe (TH), Karlsruhe Germany, 2 Institut für Nanotechnologie, Forschungszentrum Karlsruhe, Karlsruhe Germany, 4 Chemistry Department, University of Toronto, Toronto, Ontario, Canada, 3 DFG-CFN, Universität Karlsruhe (TH), Karlsruhe Germany

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11:45 AM - **D1.5/AA1.5
Nano-Fabrication of 3D Optoelectronic Devices by Atomic Layer Deposition

Christopher Summers 1 , Elton Graugnard 1 , Davy Gaillot 1 , John Blair 1 , Olivia Roche 2 , David Sharp 2 , Robert Denning 3 , Andrew Turberfield 2
1 Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia, United States, 2 Department of Physics, University of Oxford, Oxford United Kingdom, 3 Inorganic Chemistry Laboratory, University of Oxford, Oxford United Kingdom

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12:15 PM - D1.6/AA1.6
Periodic Nanostructures Templated from Two-Dimensional and Three-Dimensional Colloidal Crystals

Peng Jiang 1
1 Chemical Engineering, University of Florida, Gainesville, Florida, United States

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12:30 PM - D1.7/AA1.7
Effect of SiC Whisker Growth on Cordierite Honeycomb by CVI Process.

Hwan Sup Lee 1 , Ik Whan Kim 1 , Doo Jin Choi 1 , Hia Doo Kim 2
1 Department of Ceramic Engineering, Yonsei University , Seoul Korea (the Republic of), 2 Department of Materials Engineering, Korea Institute of Machinery and Materials, Seoul Korea (the Republic of)

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D2: Feature Filling in Supercritical Fluids and Electrolytes
Session Chairs
Daniel Josell
James Watkins
Tuesday PM, April 10, 2007
Room 3003 (Moscone West)

2:30 PM - **D2.1
Conformal Deposition of Metal, Metal Oxide and Mixed Metal Oxide Films within Nanostructured Device Features from Supercritical Fluids.

Adam O'Neil 1 , Christos Karanikas 2 , James Watkins 1
1 Polymer Science and Engineering, University of Massachusetts, Amherst, Massachusetts, United States, 2 Chemical Engineering, University of Massachusetts, Amherst, Massachusetts, United States

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3:00 PM - D2.2
Detailed Kinetics and Conformal Coverage in High Aspect Ratio Features for the Deposition of Ruthenium from Supercritical Carbon Dioxide.

Christos Karanikas 1 , James Watkins 2
1 Chemical Engineering, University of Massachusetts Amherst, Amherst, Massachusetts, United States, 2 Polymer Science and Engineering, University of Massachusetts Amherst, Amherst, Massachusetts, United States

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3:15 PM - D2.3
Novel “Topography-sensitive” Bottom-up mode for Filling Nano-features Using Superciritical Fluids as a Deposition Medium.

Eiichi Kondoh 1 , Michiru Hirose 1
1 , Univ. Yamanashi, Kofu Japan

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3:30 PM - D2.4
Quantitative Evaluation of Gap-filing and Conformal Deposition in High Aspect Ratio Features by Supercritical Fluid Deposition of Copper.

Takeshi Momose 1 , Masakazu Sugiyama 2 , Yukihiro Shimogaki 1
1 Department of Materials Engineering, The University of Tokyo, Tokyo Japan, 2 Institute of Engineering Innovation, The University of Tokyo, Tokyo Japan

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3:45 PM - *
Break

4:15 PM - **D2.5
Chemical Processing for On-Chip Interconnects.

Valery Dubin 1
1 , eMAT Technology, Moses Lake, Washington, United States

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4:45 PM - **D2.6
Electroless Deposition for ULSI Cu Interconnects Application

Tetsuya Osaka 1 , Madoka Hasegawa 1 , Masahiro Yoshino 1
1 Dept. of Applied Chemistry, Waseda University, Tokyo Japan

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5:15 PM - **D2.7
Advanced Cu Electrodeposition Technology for Next Generation Damascene Metallization.

Jae Jeong Kim 1 , Sung Ki Cho 1
1 School of chemical and biological engineering, Seoul National University, Seoul Korea (the Republic of)

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5:45 PM - D2.8
Bottom-up Feature Filling with Mobile Adsorbates: Contrasting Cu, Ag and Au Superfilling of Sub-micrometer Trenches and Vias.

Daniel Josell 1 , Thomas Moffat 1 , Daniel Wheeler 1
1 Metallurgy Division, NIST, Gaithersburg, Maryland, United States

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2007-04-11   Show All Abstracts

Symposium Organizers

Daniel Josell National Institute of Standards and Technology
Michael Brett University of Alberta
Christian Witt AMD c/o IBM T. J. Watson Research Center
Mikko Ritala University of Helsinki
D3: ALD and CVD for Trenches, Vias and Pillars
Session Chairs
Sywert Brongersma
Christian Witt
Wednesday AM, April 11, 2007
Room 3003 (Moscone West)

9:30 AM - **D3.1
Issues with Narrow Trench Metallization.

Sywert Brongersma 1 , L. Carbonell 1 , Z. Tokei 1
1 , IMEC, Leuven Belgium

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10:00 AM - **D3.2
Deposition of Conformal Thin Films by Atomic Layer Deposition.

Markku Leskela 1 , Marianna Kemell 1 , Markus Lautala 1 , Tero Pilvi 1 , Viljami Pore 1 , Eero Santala 1 , Mikko Ritala 1
1 Department of Chemistry, University of Helsinki, Helsinki Finland

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10:30 AM - **D3.3
Control of Step Coverage in Atomic Layer Deposition (ALD): Theory and Applications

Roy Gordon 1
1 Chemistry and Chemical Biology, Harvard University, Cambridge, Massachusetts, United States

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11:00 AM - *
Break

11:30 AM - D3.4
Novel ALD WCx Process for High Aspect Ratio Structure.

Wei-Min Li 1 , Eva Tois 1 , Kurt Verheyden 2 , Jeroen van Hapert 2
1 , ASM Microchemistry Ltd, Helsinki Finland, 2 , ASM Belgium N.V., Leuven Belgium

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11:45 AM - D3.5
CVD Controlled by Surface Chemistry: Superconformal Coverage and Filling of Deep Trenches and Vias

John Abelson 1 , Yu Yang 1 , Sreenivas Jayaraman 1 , Do-Young Kim 2 , Navneet Kumar 1 , Sophia Lazarz 1 , Wontae Noh 2 , Gregory Girolami 2
1 Materials Science and Engineering, U. Illinois at Urbana-Champaign, Urbana, Illinois, United States, 2 Department of Chemistry, U. Illinois at Urbana-Champaign, Urbana, Illinois, United States

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12:00 PM - D3.6
Analysis and Simulation of Conformal and Super-Conformal CVD on High Aspect Ratio Features.

Yu Yang 1 , Gregory Girolami 2 , John Abelson 1
1 Materials Science and Engineering, U. Illinois at Urbana-Champaign, Urbana, Illinois, United States, 2 Dept. of Chemistry, U. Illinois at Urbana-Champaign, Urbana, Illinois, United States

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12:15 PM - D3.7
Thin Polymeric Trench Coatings via Initiated Chemical Vapor Deposition.

Salmaan Baxamusa 1 , Karen Gleason 1
1 Chemical Engineering, Massachusetts Institute of Technology, Cambridge, MA, Massachusetts, United States

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12:30 PM - D3.8
Chemical Vapour Deposition of Boron for Neutron Detector Application

Nirmalendu Deo 1 , Joseph Brewer 1 , Chin Cheung 1 2 , Rebecca Nikolić 3 , Catherine Reinhardt 3 , Tzu-Fang Wang 4
1 Chemistry, University of Nebraska-Lincoln, Lincoln, Nebraska, United States, 2 Nebraska Center for Materials and Nanoscience, University of Nebraska-Lincoln, Lincoln, Nebraska, United States, 3 Center for Micro and Nano Technology, Lawrence Livermore National Laboratory, Livermore, California, United States, 4 Directorate of Chemistry and Materials Sciences, Lawrence Livermore National Laboratory, Livermore, California, United States

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12:45 PM -
D3.9 TRANSFERRED TO A8.8

D4: Novel Fabrication and Stress Mitigration Strategies
Session Chairs
Michael Brett
Sean Hearne
Wednesday PM, April 11, 2007
Room 3003 (Moscone West)

2:30 PM - **D4.1
Porous Thin Film 3-D Nanostructures on Seeded Substrates Grown by Glancing Angle Deposition.

Jeremy Sit 1
1 Electrical and Computer Engineering, University of Alberta, Edmonton, Alberta, Canada

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3:00 PM - D4.2
Full System Model of Magnetron Sputter Chamber - Proof of Principle Study

Chris Walton 1 , George Gilmer 1 , Aaron Wemhoff 1 , Luis Zepeda-Ruiz 1
1 , Lawrence Livermore National Laboratory, Livermore, California, United States

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3:15 PM - D4.3
Novel Vapor Phase Method for Making Ultra Thin Conformal Films.

Sushant Gupta 1 , Rajiv Singh 1 , Arul Chakkaravarthi 1 , Jeff Opalko 2 , Deepika Singh 2
1 Materials Science & Engineering, University of Florida, Gainesville, Florida, United States, 2 , Sinmat Inc., Gainesville, Florida, United States

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3:30 PM - D4.4
Aerosol-Robo-Printing: Writing Ordered Nanostructures on Arbitrary Surfaces with Self-Assembling Inks

Jiebin Pang 1 2 , John Stuecker 2 , Ajay Bhakta 1 , Yingbing Jiang 2 , Joseph Cesarano 2 , Paul Calvert 3 , David Sutton 4 , C. Jeffrey Brinker 1 2
1 NSF/UNM Center for Micro-Engineered Materials, The University of New Mexico, Albuquerque, New Mexico, United States, 2 Advanced Materials Lab, Sandia National Laboratories, Albuquerque, New Mexico, United States, 3 Department of Materials and Textiles, University of Massachusetts Dartmouth, North Dartmouth, Massachusetts, United States, 4 Strategic Technology Group, Imperial Chemical Industries, Wilton, Redcar, United Kingdom

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4:00 PM - *
Break

4:30 PM - **D4.6
Through-mask Electrodeposition to Study Intrinsic Stress Evolution During Thin Film Growth

Sean Hearne 1 , Jerrold Floro 2 , Abhinav Bhandari 3 1 , Brian Sheldon 3
1 , Sandia National Labs., Albuquerque, New Mexico, United States, 2 Department of Material Science and Engineering, U. of Virginia, Charlottesville, Virginia, United States, 3 Division of Engineering, Brown University, Providence, Rhode Island, United States

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5:00 PM - D4.7
Corrugated Diamond Foils by CVD Growth on Patterned Silicon.

Robert Shaw 1 , C. Feigerle 2 , M. Plum 3 , T. Spickermann 4
1 Chemical Sciences, Oak Ridge National Laboratory, Oak Ridge, Tennessee, United States, 2 Chemistry, Univ. of Tennessee/Knoxville, Knoxville, Tennessee, United States, 3 Spallation Neutron Source, Oak Ridge National Laboratory, Oak Ridge, Tennessee, United States, 4 LANSCE, Los Alamos National Laboratory, Los Alamos, New Mexico, United States

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5:15 PM - D4.8
Growth of InP on Nanoscale-Patterned Si (100) Substrates by Metalorganic Vapor-Phase Epitaxy

Robyn Woo 1 , Siu Cheng 1 , Li Gao 1 , Robert Hicks 1
1 Chemical and Biomolecular Engineering, University of California, Los Angeles, Los Angeles, California, United States

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5:30 PM - D4.9
Ge Dots Self-assembly on Nanostructured Substrate.

Isabelle Berbezier 1 , Antoine Ronda 1
1 L2MP, CNRS, Marseille France

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5:45 PM - D4.10
Highly Localized Light Emission From an Organic Device Deposited on an Atomic Force Microscopy Probe Tip Due to Field-assisted Carrier Injection at the Sharp Tip.

Yiying Zhao 1 , Kevin Pipe 2 , Max Shtein 1
1 Department of Materials Science and Engineering, University of Michigan, Ann Arbor, Michigan, United States, 2 Department of Mechanical Engineering, University of Michigan, Ann Arbor, Michigan, United States

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