Chairs

C.P. Wong Sam Purushothaman
AT&T Bell Laboratories IBM T.J. Watson Research Center

John Lau Ho-Ming Tong
Hewlett-Packard IBM Microelectronics

Symposium Support

IBM
AT&T Bell Laboratories
Gould Electronics


*Invited Paper

SESSION M1: MATERIALS ISSUES IN STORAGE TECHNOLOGY
Chair: Sury Hegde
Monday Morning, April 8
Sunset A

8:30 A.M. *M1.1
MATERIALS FOR ULTRAHIGH DENSITY RECORDING, Mark H. Kryder, Carnegie Mellon University, Engineering Research Center for Data Storage Systems, Pittsburgh, PA.

9:00 A.M. *M1.2
TECHNOLOGY ROADMAP FOR THIN FILM MAGNETIC MEDIA, Michael A. Russak, HMT Technology Corporation, Fremont, CA.

9:30 A.M. *M1.3
THE REVOLUTION IN MAGNETORESISTIVE MATERIALS, James Brug, Hewlett-Packard Laboratories, Palo Alto, CA.

10:00 A.M. BREAK

10:15 A.M. *M1.4
HEAD/DISK INTERFACE TRIBOLOGY-EXPERIMENT AND SIMULATION, Carl G. Harkins, Hewlett-Packard Laboratories, Thin Film Department, Palo Alto, CA; Andrew P. Horsfield and Adrian P. Sutton, University of Oxford, Department of Materials, Oxford, United Kingdom; Robert G. Walmsley, Hewlett-Packard Laboratories, Palo, Alto, CA.

10:45 A.M. *M1.5
CORROSION STUDIES OF MAGNETIC STORAGE DEVICES, Gerald S. Frankel, The Ohio State University, Department of Materials Science and Engineering, Columbus, OH.

11:15 A.M. M1.6
HREM STUDY OF Co/Cu/Co SPIN VALVES, Pascale Bayle-Guillemaud, Amanda K. Petford-Long, University of Oxford, Department of Materials, Oxford, United Kingdom; Thomas C. Anthony and James A. Brug, Hewlett-Packard Laboratories, Palo Alto, CA.

11:30 A.M. M1.7
BALLISTIC CONDUCTANCE IN MAGNETIC MULTILAYERS, E.Y. Tsymbal, A.M. Bratkovsky, A.T. Paxton and D.G. Pettifor, University of Oxford, Materials Modelling Laboratory, Department of Materials, Oxford, United Kingdom.

11:45 A.M. M1.8
ANNEALING EFFECT OF GIANT MAGNETORESISTANCE IN MAGNETIC COUPLED NiFe/Cu/CoFe/Cu MULTILAYERED STRUCTURES, Q. Leng, J. Bresowar, M.T. Kief, S. Hossain and M.R. Parker, University of Alabama, Center for Materials for Information Technology, Tuscaloosa, AL.

SESSION M2: STORAGE TECHNOLOGY/PRINTING TECHNOLOGY
Chair: Phillip Trouilloud
Monday Afternoon, April 8
Sunset A

1:30 P.M. M2.1
ENHANCEMENT OF THE MAGNETORESISTANCE BY INTERFACE MODIFICATION WITH SILVER IN Co/Cu ARTIFICIAL SUPERLATTICES, Joo-Wook Park and Seung-Ki Joo, Seoul National University, Department of Metallurgical, Seoul, Korea.

1:45 P.M. M2.2
THIN FILM MAGNETOSTRICTIVE METGLAS FOR MICROSENSING APPLICATIONS, Y. Lu and A. Nathan, University of Waterloo, Department of Electrical and Computer Engineering, Waterloo, Canada.
2:00 P.M. M2.3
FABRICATION OF NONEPITAXIAL COLOSSAL MAGNETORESISTIVE THIN FILMS USING DUAL ION BEAM DEPOSITION, Michael J. Cima, Neville Sonnenberg, Kevin G. Ressler, Massachusetts Institute of Technology, CPRL, Cambridge, MA.

2:15 P.M. M2.4
MULTILAYER OF Co-DOPED AND UNDOPED YIG THIN FILM AS NEW MAGNETO-OPTIC STORAGE MEDIA, V.N. Moorthy, Sandip Dhara, A.C. Rastogi and B.K. Das, National Physical Laboratory, Materials Division, New Delhi, India.

2:30 P.M. M2.5
COBALTOUS OXIDE INFILTRATED YIG THIN FILM AS HIGH COERCIVITY MEDIA FOR DATA STORAGE, V.N. Moorthy, Sandip Dhara, A.C. Rastogi and B.K. Das, National Physical Laboratory, Materials Division, New Delhi, India.

2:45 P.M. M2.6
UNDERLAYER CONTROL FOR ENHANCEMENT OF COERCIVITY IN Co/Pd AND Co/Pt MULTILAYERS, Hoon-Sang Oh and Seung-Ki Joo, Seoul National University, Department of Metallurgical Engineering, Seoul, Korea.

3:00 P.M. BREAK

3:15 P.M. *M2.7
MATERIALS ISSUES IN THERMAL INK JET PRINTING, Alfred I. Pan, Hewlett-Packard, Palo Alto, CA.

3:45 P.M. M2.8
A 3D JET PRINTING METHOD FOR THE PRODUCTION OF MULTILAYER DEVICES, Mohan J. Edirisinghe, Philip F. Blazdell, Qiang F. Xiang and Julian R.G. Evans, Brunel University, Materials Technology, Uxbridge, United Kingdom.

4:00 P.M. *M2.9
MATERIALS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING, D.D.L. Chung, State University of New York at Buffalo, Composite Materials Research Laboratory, Buffalo, NY.

4:30 P.M. M2.10
POLYMER BASED ELECTRICAL INTERCONNECTIONS, Tedjar Farouk, Grenoble, France; and Vaucher Christophs, Bandol, France.

4:45 P.M. M2.11
MICROPOROUS SILOXANE ELASTOMERS FOR PACKAGING INTERCONNECTIONS, TESTING AND BURN-IN APPLICATIONS, D.M. Alberto, C.J.G. Plummer, J.G. Hilborn, Swiss Federal Institute of Technology, Materials Department, Polymer Laboratory, Lausanne, Switzerland; J.L. Hedrick, R.D. Miller and D.Y. Shih, IBM Almaden Research Center, San Jose, CA.

SESSION M3: MATERIALS AND PROCESS ISSUES
IN PORTABLE BATTERIES
Chair: C.P. Wong
Tuesday Morning, April 9
Sunset A

8:30 A.M. *M3.1
MATERIALS OPPORTUNITIES IN BATTERIES FOR PORTABLE ELECTRONICS, D.W. Murphy, AT&T Bell Laboratories, Solid State Chemistry Reserach Department, Murray Hill, NJ.

9:00 A.M. *M3.2
THE Li-ION TECHNOLOGY: ITS EVOLUTION AND SOME MATERIALS ASPECTS, J.-M. Tarascon, Université de Picardie Jules Verne, Amiens France and Bellcore, Red Bank, NJ; T. Gozdz, G. Amatucci, C. Schmutz, F. Shokoohi and P. Warren, Bellcore, Red Bank, NJ.

9:30 A.M. *M3.3
ADVANCES AND NEEDS FOR BATTERY MATERIALS RESEARCH, D.D.L. Chung, State University of New York at Buffalo, Composite Materials Research Laboratory, Buffalo, NY.

10:00 A.M. BREAK

10:30 A.M. *M3.4
POWERDEXreg. PRISMATIC BATTERIES FOR SUPERSMART CARD APPLICATIONS, Anthony Wong and Tibor Kalnoki-Kis, Gould Electronics Inc., Powerdex Division, Eastlake, OH.

11:00 A.M. M3.5
LOW TEMPERATURE SPINEL STRUCTURE FORMATION OF Li-Mn-O THIN FILMS FOR RECHARGEABLE MICROBATTERIES, Kyu-Ho Hwang and Seung-Ki Joo, Seoul National University, Department of Metallurgical Engineering, Seoul, Korea.
11:15 A.M. M3.6
PULSED LASER DEPOSITION OF VANADIUM OXIDE THIN FILMS AND THEIR LITHIUM CHARGING CAPACITIES, Jeanne M. McGraw, Ji-Guang Zhang, David Ginley and John Turner, National Renewable Energy Laboratory, Golden, CO.

11:30 A.M. M3.7
INTERCALATION CHEMISTRY OF COBALT AND NICKEL DIOXIDES: A FACILE ROUTE TO NEW COMPOUNDS, Michael Lerner and Chris Oriakhi, Oregon State University, Chemistry Department, Corvallis, OR.

11:45 A.M. M3.8
ADVANCED LITHIUM BATTERY FOR PORTABLE ELECTRONIC DEVICES: RECYCLING OR LANDFILLING? Tedjar Farouk, Recupyl S.A., Grenoble, France.


The following exhibitors have identified their products and services as directly related to your research:

Academic Press
American Institute of Physics
Axic, Inc.
Commonwealth Scientific Corp.
Elsevier Science, Inc.
Goodfellow Corporation
Heraeus Amersil, Inc.
IOP Publishing, Inc.
Kluwer Academic Publishers
Lake Shore Cryotronics, Inc.
Magnet Sales & Manufacturing
Philips Semiconductors/Materials Analysis Group
Plasma Sciences, Inc.
Research & PVD Materials Corp.

See page 6 for a complete list of exhibitors.