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Symposium Sessions

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  • Broader Impact (BI)
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  • Energy (EN)
  • Flexible, Wearable Electronics, Textiles and Sensors (FL)
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  • Nanomaterials and Quantum Materials (NM)
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  • Structural and Functional Materials (SF)

Please note: On demand presentations do not have times assigned. Presentations with times assigned are Live presentations.

Symposium F.EN01—Emerging Dielectric Materials—Applications in Energy Transmission, Storage and Conversion

This symposium will broadly cover emerging dielectric materials and application in energy transmission, storage, and conversion. There will be 10 technical topics included in this symposium that can be divided into three parts. The first part of the symposium as represented by topics 1-4 which will focus on advanced dielectric materials required for modern electronics and electrical power systems including: capacitive energy storage, electrical insulation for power delivery, and key components for electrical circuits such as gate dielectric in thin-film transistors and materials for thermal management and packaging. The second part of the symposium comprising topics 5-7 will focus on advanced functional dielectrics for energy conversion including: piezoelectric materials with extraordinary piezoelectric response (polymers, ceramics, single crystals and molecular perovskite solid solutions), dielectric elastomers and their newly developed application in actuation and mechanical energy harvesting, and electrocaloric materials with giant cooling power density for the next generation of solid-state refrigeration. The third part of the symposium is composed of topics 8-10. and will focus on state-of-the-art research in dielectric materials. For instance, the interface effect has long been regarded as the central issue to be understood in heterogeneous dielectric materials. Novel synthesis and characterization techniques have led to excitement in the community due to the discovery of new materials and deepened understanding of dielectric phenomena. Computational modeling has recently emerged as a very competitive approach to the study of dielectric materials, and has already showed promise in the design and prediction of new dielectric materials. Abstracts will be solicited in the research areas as described in the aforementioned 10 topics.


Topics will include:

  • Advanced dielectrics for electrical energy storage
  • Dielectric and electrical insulation materials for power delivery
  • Gate dielectrics for thin-film transistors
  • Thermally conductive and electrically insulating materials for thermal management
  • Piezoelectric materials for mechanical-electrical energy interconversion
  • Dielectric elastomers for actuators and mechanical energy harvesting
  • Electrocaloric materials for solid-state cooling
  • Characterization and properties of the interface in heterogeneous dielectric materials
  • Novel synthesis and characterization techniques of dielectric materials
  • Computational modeling in dielectric materials

Invited Speakers:

  • Emiliano Bilotti (Queen Mary University of London, United Kingdom)
  • Hua Deng (Sichuan University, China)
  • Jinghui Gao (Xi'an Jiaotong University, China)
  • Julia W. P. Hsu (The University of Texas at Dallas, USA)
  • Xiao Hu (Nanyang Technological University, Singapore)
  • Jiangyu Li (University of Washington, USA)
  • Zhuo Li (Fudan University, China)
  • Wenfeng Liu (Xi’an Jiaotong University, China)
  • Takuya Morishita (Toyota Central R&D Labs, Inc., Japan)
  • Qibing Pei (University of California, Los Angeles, USA)
  • Rampi Ramprasad (Georgia Institute of Technology, USA)
  • Alain Sylvestre (Université Grenoble Alpes, France)
  • Susan Trolier-Mckinstry (The Pennsylvania State University, USA)
  • Enis Tuncer (Texas Instruments Incorporated, USA)
  • Mikael Unge (NKT HV Cables AB, Technology Consulting, Sweden)
  • Qing Wang (The Pennsylvania State University, USA)
  • Shuhui Yu (Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China)
  • Jinkai Yuan (Centre de Recherche Paul Pascal, France)
  • Lei Zhu (Case Western Reserve University, USA)

Symposium Organizers

Jinbo Bai
Université Paris-Saclay
Structures et Matériaux, Université Paris-Saclay
France

Xingyi Huang
Shanghai Jiao Tong University
China

Qi Li
Tsinghua University
China

Linda S. Schadler
The University of Vermont
USA

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