Symposium SF01-Thermal Transport in Materials

This symposium will broadly cover topics related to thermal transport in materials, ranging from fundamental understanding at the nanoscale to applications in energy and thermal management. The first part of the symposium will focus on current and emerging thermal materials, exploring advancements in the fundamental understanding of heat transport phenomena. Discussions will include nanoscale transport that deviates from Fourier’s diffusion theory, thermal conductivity of soft and amorphous materials, phonon dynamics in complex materials, as well as interfacial transport. Fundamental interactions between energy carriers, such as electrons, phonons, magnons, and/or photons, will also be included. The topics will further extend to the emerging phenomena, such as thermal Hall effect and chiral phonons. The second part of the symposium will focus on recent developments in methodology, both theoretical and experimental. This will explore simulation methods, including first principles, atomistic Green’s function, and molecular dynamics, that lead to materials discovery and novel thermal science, which is further facilitated by machine learning and artificial intelligence. Discussions will also include advanced thermal metrology based on pump-probe, optical spectroscopy, electron microscopy, microfabricated platforms etc., that exhibit improved spatial and temporal resolutions, 3D depth-resolved scheme, high-throughput capability, and microscopic phonon dynamics. The third part of the symposium will focus on emerging functionalities of thermal materials and their applications in energy conversion and thermal management. The symposium will also feature insights from industry professionals who apply their understanding of heat transport to address practical engineering challenges.

Topics will include:

  • Thermal conductance/conductivity of interfaces, amorphous materials, complex materials, and composites
  • Thermal materials in extreme conditions
  • Thermal radiation at the nanoscale
  • Emerging phonon phenomena – phonon thermal hall effect and chiral phonons and underlying fundamental interactions
  • Thermal metrology for materials and devices
  • Modeling and theory of nanoscale heat transport
  • Machine learning and artificial intelligence for thermal materials
  • Thermal energy conversion and storage
  • Thermal management of microelectronics and personal and energy systems

Invited Speakers (tentative):

  • David G. Cahill (University of Illinois at Urbana-Champaign, USA)
  • Gang Chen (Massachusetts Institute of Technology, USA)
  • Renkun Chen (University of California, San Diego, USA)
  • Patrick Hopkins (University of Virginia, USA)
  • Ming Hu (University of South Carolina, USA)
  • Yongjie Hu (University of California, Los Angeles, USA)
  • Seung Hwan Ko (Seoul National University, Republic of Korea)
  • Chang-Seok Lee (Samsung Electronics, Republic of Korea)
  • Baowen Li (Southern University of Science and Technology, China)
  • Deyu Li (Vanderbilt University, USA)
  • Lucas lindsay (Oak Ridge National Laboratory, USA)
  • Jun Liu (North Carolina State University, USA)
  • Tengfei Luo (University of Notre Dame, USA)
  • Jonathan Malen (Carnegie Mellon University, USA)
  • Amy Marconnet (Purdue University, USA)
  • Alan McGaughey (Carnegie Mellon University, USA)
  • Austin J. Minnich (California Institute of Technology, USA)
  • Eric Pop (Stanford University, USA)
  • Xiulin Ruan (Purdue University, USA)
  • Li Shi (The University of Texas at Austin, USA)
  • Sunmi Shin (National University of Singapore, Singapore)
  • Junichiro Shiomi (The University of Tokyo, Japan)
  • Xiaojia Wang (University of Minnesota Twin Cities, USA)
  • Yaguo Wang (The University of Texas at Austin, USA)
  • Richard Wilson (University of California, Riverside, USA)
  • Xianfan Xu (Purdue University, USA)
  • Mona Zebarjadi (University of Virginia, USA)

Symposium Organizers

Hyejin Jang
Seoul National University
Republic of Korea
No Phone for Symposium Organizer Provided , [email protected]

Tianli Feng
The University of Utah
USA
No Phone for Symposium Organizer Provided , [email protected]

Yee Kan Koh
National University of Singapore
Singapore

Zhiting Tian
Cornell University
Sibley School of Mechanical and Aerospace Engineering
USA

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MRS publishes with Springer Nature