Symposium SB01-Soft Materials in Human–Machine Interfaces—Design, Integration and Performance

In the era of ever-evolving technology, this symposium serves as a critical exploration of the transformative role soft materials play in shaping the future of human-machine interactions. Soft materials, including but not limited to elastomers, polymers, textiles, and hydrogels, have emerged as pivotal elements in the design of interfaces that are responsive, adaptive, and comfortable for users. This symposium is dedicated to comprehensively investigating the design aspects, integration challenges, and performance evaluation of soft materials in human-machine interfaces (HMIs). Through a multidisciplinary approach, it aims to unravel the full potential of soft materials in enhancing the user experience and expanding the horizons of technological integration. The symposium will provide a platform for leading researchers, engineers, and innovators to exchange insights on the design principles underpinning soft material-based HMIs. Presentations and discussions will revolve around the latest advances in soft materials and applications. These topics will shed light on the innovative ways in which soft materials can be manipulated to create interfaces that are not only highly functional but also adaptable and intuitive. Moreover, the symposium will delve into the intricacies of how soft materials can be seamlessly incorporated into a wide range of applications, from wearable technology to medical devices. In addition to design and integration, the symposium also places a strong emphasis on the performance evaluation of soft material-based HMIs. Experts can share research findings and methodologies for assessing the efficacy and user satisfaction of such interfaces. Attendees will gain insights into measuring and enhancing the reliability, safety, and user experience of these soft material interfaces. By bringing together diverse perspectives and fostering collaboration, this symposium aims to accelerate the development of soft material solutions that enable more natural, intuitive, and comfortable interactions between humans and machines. Participants will leave with a deeper understanding of the potential of soft materials in revolutionizing the landscape of human-machine interfaces.

Topics will include:

  • Wearable electronics based on soft materials
  • Soft materials for neural electrodes
  • Soft materials for biointegration
  • Soft materials for robotics
  • Soft bioadhesives
  • Soft materials for energy harvesting
  • Hydrogels for implants
  • Soft Stimuli-responsive materials
  • Minimally-invasive implants based on soft materials
  • Ingestible devices based on soft materials

Invited Speakers (tentative):

  • Zhenan Bao (Stanford University, USA)
  • Wei Gao (California Institute of Technology, USA)
  • Debkalpa Goswami (Case Western Reserve University, USA)
  • Dae-Hyeong Kim (Seoul National University, Republic of Korea)
  • Stéphanie Lacour (École Polytechnique Fédérale de Lausanne, Switzerland)
  • Jianyu Li (McGill University, Canada)
  • Nanshu Lu (The University of Texas at Austin, USA)
  • George Malliaras (University of Cambridge, United Kingdom)
  • Naoji Matsuhisa (The University of Tokyo, Japan)
  • Ivan Minev (Technische Universität Dresden, Germany)
  • Seongjun Park (Korea Advanced Institute of Science and Technology, Republic of Korea)
  • John Rogers (Northwestern University, USA)
  • Takao Someya (The University of Tokyo, Japan)
  • Jeong-Yun Sun (Seoul National University, Republic of Korea)
  • Bozhi Tian (The University of Chicago, USA)
  • Sihong Wang (The University of Chicago, USA)
  • Xuanhe Zhao (Massachusetts Institute of Technology, USA)

Symposium Organizers

Tao Zhou
The Pennsylvania State University
Engineering Science and Mechanics; Materials Research Institute
USA
No Phone for Symposium Organizer Provided , [email protected]

Vivian Feig
Stanford University
Department of Mechanical Engineering
USA
No Phone for Symposium Organizer Provided , [email protected]

Christina Tringides
ETH Zürich
Switzerland
No Phone for Symposium Organizer Provided , [email protected]

Hyunwoo Yuk
Korea Advanced Institute of Science and Technology
Republic of Korea
No Phone for Symposium Organizer Provided , [email protected]

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