Boron in The Back-End: Advances in Boron-Based Solids for Interconnect Applications

Playing a less glamorous yet critically important role, the interconnect system requires relentless innovation to support more complex and higher-density device architectures. To meet future demands, we require a constant supply of novel and better materials, material fabrication methods, and material combinations. Known for their robust mechanical, chemical, thermal, and electrical properties, boron-based solids are a compelling alternative to silicon-based solids for a range of interconnect material needs, to include low-dielectric-constant (low-<i>k</i>) dielectrics, etch stops, diffusion barriers, hard masks, spacers, capping layers, and other patterning-assist layers. This talk with cover advances in boron-based solids, including BC and BN, for state-of-the-art interconnect applications, touching on fundamental materials science, layer-by-layer deposition techniques, and functional and patterning applications.