A Double-Sided Coil Patterned Ultra-Thin Silicon Substate

Fabrication of devices on ultra-thin silicon(UTS) substrate has significantly advanced as the demand for flexible and compact devices rises. However, the majority of research only focuses on a conventional single-sided fabrication and does not implement a double-sided fabrication due to challenges in fabrication on a UTS substrate. Here we implement a pattern transfer technique that enables transferring the UTS freely between substrates and even flipping the UTS at any step between processes. As an example, we fabricated a double-sided coil patterned UTS substrate(DCUTS) and demonstrated its functionality as an actuator and vibrational energy harvester. A combination of experimental, computational, and theory-based simulation modeling results are presented. The results prove the possibility of adopting this technique in fabricating double-sided, namely, higher density devices or multi-functional devices through two different patternings on the front and back sides.