Integrating 2D Materials in Silicon Microchips

Two-dimensional layered materials (2D-LMs) materials have outstanding physical, chemical and thermal properties that make them attractive for the fabrication of solid-state micro/nano-electronic devices and circuits. However, synthesizing high-quality 2D-LMs at the wafer scale is difficult, and integrating them in semiconductor production lines brings associated multiple challenges. Nevertheless, in the past few years substantial progress has been achieved and leading companies like TSMC, Samsung and IMEC have started to work more intensively on the fabrication of devices using 2D-LMs. In this talk, I will discuss the state-of-the-art on micro/nano-electronic devices made (entirely or partially) of 2D-LMs, the most sophisticated circuits ever constructed, and the fabrication of CMOS/2D hybrid microchips. I will put special emphasis on devices that employ hexagonal boron nitride, the only 2D-LM with an enough high band gap to be employed as dielectric. I will also discuss the main technological challenges to face in the next years and provide some recommendations on how to solve them.