Soft, Skin-Safe Electronic Device Interfaces for Continuous Health Monitoring

<b>Abstract</b><br/>Soft electronic device interface directly with the skin surface allows essential physiological health monitoring. These devices, featuring soft and miniaturized architecture, wireless communication capabilities, and an independent power system, significantly reduce patient burden by eliminating wired connections and bulky hardware of traditional hospital-grade systems. Previous efforts by soft, thin structures with high biocompatibility addressed the many skin damage problems but still present challenges, especially when in direct contact with the delicate skin of ill infants with small anatomical bodies and low-risk perception ability. Here, we report materials and structural design strategies to enhance skin safety during clinical use, especially for infants, without hampering the unique characteristics of the device architectures and the electronic performance. Pre-curved and holey design conforms to the anatomical body and rapidly and effectively releases interface adhesion, significantly reducing skin irritation. Furthermore, an ultrathin, flexible bladder containing small amounts of liquid with a low boiling point provides an active thermal safety system to these soft, skin electronic devices. In a thermal malfunction, the heat evaporates the liquid inside the bladder, forming an effective thermal barrier and automatically delaminating the device from the skin. Our material and structural design approach aims to ensure the safe and reliable use of soft electronic devices for infant health monitoring, promoting overall well-being and comfort during usage.<br/><br/><b>References</b><br/>[1] S.S. Kwak, S. Yoo, R. Avila, H.U. Chung, H. Jeong, C. Liu, J.L. Vogl, J. Kim, H.-J. Yoon, Y. Park, H. Ryu, G. Lee, J. Kim, J. Koo, Y.S. Oh, S. Kim, S. Xu, Z. Zhao, Z. Xie, Y. Huang and J.A. Rogers, "Skin-Integrated Devices with Soft, Holey Architectures for Wireless Physiological Monitoring, With Applications in the Neonatal Intensive Care Unit," Advanced Materials 33, 2103974 (2021).<br/>[2] S. Yoo, T. Yang, M. Park, H. Jeong, Y.J. Lee, D. Cho, J. Kim, S.S. Kwak, J. Shin, Y. Park, Y. Wang, N. Miljkovic, W.P. King and J.A. Rogers, “Responsive Materials and Mechanisms as Thermal Safety Systems for Skin-Interfaced Electronic Devices,” Nature Communications 14:1024 (2023).