2022 MRS Fall Meeting & Exhibit

Call for Papers

Abstracts were due June 16, 11:59 pm EDT.

Symposium SB03-Materials and Designs for 3D Bioelectronic Interfaces

Recent advances in soft functional materials have created a wealth of opportunities for the construction electronic tools with tissue-like mechanical properties. When integrated with natural biological tissues, these devices could enable advanced means for physiological sensing and delivery of therapeutic stimulation. However, biological organs usually involve dynamic 3D structures, which is difficult to interface with electronic devices manufactured with conventional planar processing techniques. Resolving this mismatch in form factors would require multi-disciplinary efforts in materials exploration, structural design and innovation in fabrication techniques.

This symposium will focus on the emerging approaches to addressing the challenge of 3D interfacing between soft electronic tools and complex biological organs and tissues. The expanding library of soft electronic materials has enabled active devices with shape-morphing capabilities. Inspirations from Nature and paper arts provided design guidelines for organ-conformal integration. Unconventional fabrication techniques allowed patterning and integration of materials components into sophisticated 3D devices. These and other methods span across a broad spectrum of materials science and device engineering, leading to electronic tools for bio-integration at multiple length scales. These devices could help to address many urgent demands in cardiac physiological investigation, neuroscience, tissue engineering and other areas in biomedicine. This symposium will also include discussions on long-term operation of devices, multiplexity of sensors, scalable manufacturing, data processing as well as other remaining challenges and future opportunities.

Topics will include:

  • Biomimetic Materials for Bio-Integrated Electronics
  • Mechanics for Tissue-Electronics Interactions
  • Biocompatibility of Soft Electronics
  • Design and Fabrication of Curvy Electronics
  • 3D-Printed Bioelectronics
  • 3D Bioelectronics Inspired by Origami and Kirigami
  • Image-Guided Designs for Soft Bioelectronics
  • Organ-Conformal Electronics
  • 3D Electronics for Cellular Interfaces

Invited Speakers (tentative):

  • Zhenan Bao (Stanford University, USA)
  • Tal Dvir (Tel Aviv University, Israel)
  • Ximin He (University of California, Los Angeles, USA)
  • YongAn Huang (Huazhong University of Science & Technology, China)
  • Dae-Hyeong Kim (Seoul National University, Republic of Korea)
  • Stéphanie P. Lacour (École Polytechnique Fédérale de Lausanne, Switzerland)
  • Nanshu Lu (The University of Texas at Austin, USA)
  • SuPing Lyu (Medtronic, USA)
  • Michael McAlpine (University of Minnesota, USA)
  • Silvestro Micera (École Polytechnique Fédérale de Lausanne, Switzerland)
  • Aleksandr Noy (Lawrence Livermore National Laboratory, USA)
  • Jacob Robinson (Rice University, USA)
  • John Rogers (Northwestern University, USA)
  • Xing Sheng (Tsinghua University, China)
  • Molly Stevens (Imperial College London, United Kingdom)
  • Bozhi Tian (The University of Chicago, USA)
  • Sheng Xu (University of California, San Diego, USA)
  • Cunjiang Yu (University of Houston, USA)
  • Xuanhe Zhao (Massachusetts Institute of Technology, USA)

Symposium Organizers

Lizhi Xu
The University of Hong Kong
Mechanical Engineering
Hong Kong
No Phone for Symposium Organizer Provided , xulizhi@hku.hk

Alex Chortos
Purdue University
Mechanical Engineering
No Phone for Symposium Organizer Provided , achortos@purdue.edu

Jia Liu
Harvard University
School of Engineering and Applied Sciences
No Phone for Symposium Organizer Provided , jia_liu@seas.harvard.edu

Alina Rwei
Delft University of Technology
Chemical Engineering
No Phone for Symposium Organizer Provided , A.Y.Rwei@tudelft.nl

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