2:45 PM - EN04.10.05
Towards TCO-Less Bifacial Cu-Plated SHJ Solar Cells
Can Han1,Rudi Santbergen1,Yifeng Zhao1,Daragh O'Connor1,Guangtao Yang1,Paul Procel1,Miro Zeman1,Luana Mazzarella1,Olindo Isabella1
Delft University of Technology1
Show Abstract
Silicon heterojunction (SHJ) solar cells have exhibited high efficiencies in both academia and industry [1,2]. Key challenges to be addressed in the upscaling process are the cost of materials and the abundance of the utilized elements. Therefore, consumption of Ag and In, widely used in the electrodes of SHJ devices, must be reduced [3]. Cu has proven to be a good candidate for replacing Ag electrode; however, complexity in the metallization process remains to be tackled [4]. For the widely used electrochemical Cu-plating technique, separate control is generally needed for processing both sides of the wafer, which means that one side of the wafer is protected when plating the other side [5]. This step further increases the cell production costs. On the other hand, to reduce the In consumption, basic strategies include: (i) use of In-free TCOs, such as AZO; (ii) reduction of the TCO thickness (TCO-less option); (iii) development of TCO-free SHJ devices. For (i), challenges may lie in low carrier mobility, interface/material stability issues [6]; For (iii), proof-of-concept TCO-free SHJ cells have been demonstrated recently [7], but efforts have been partially frustrated from the passivation deterioration, and contact problems [8]. Also, it is still an open question whether TCO-free design could give optimal device performance. Moreover, a TCO layer is practically needed to act as a Cu diffusion barrier layer in Cu-plating processes. To circumvent these limitations, we focus on the TCO-less solution in combination with Cu-plating metallization approach.
We developed TCOs with different opto-electrical properties, which are tin-, fluorine-, and tungsten-doped indium oxides, namely, ITO, IFO, and IWO [9][10]. By utilizing a double layer anti-reflection coating formed by TCO/SiOx layer stacks on both sides of our SHJ device structure, we performed optical simulations with varied front and back TCO/SiOx thicknesses. Results show that bifacial solar cell architecture provides the most effective way to reduce the TCO use, and the optimal optical response appears at the point where a thin TCO layer is applied, due to a low free carrier absorption and a favorable refractive index enabling light in-coupling. Thus, we applied 25 nm-thick of different TCOs on both sides of the cell precursors fabricated using plasma-enhanced chemical vapor deposition technique. Finally, we developed single step Cu-plating process on lithography patterned openings, which could well control the metal finger growth on both sides of the wafer and largely simplify the simultaneous metallization on both sides. Champions bifacial cell was observed in the devices with IWO use on front and ITO use on the rear side of the device. After applying an additional 110 nm-thick SiOx layers on both sides of the complete cell, the device parameters were measured to be: VOC = 721 mV, JSC = 39.20 mA/cm2, FF = 79.57%, η = 22.50% (n side illumination); VOC = 717 mV, JSC = 38.72 mA/cm2, FF = 79.91%, η = 22.19% (p side illumination). The bifaciality factor is 0.99. Compared to the standard TCO utilization of 75 nm and 150 nm on front and rear side of the monofacial SHJ device, respectively, we achieved comparable cell performance with a 78% reduction in TCO use. TCO thickness-dependent contact properties for both n-contact and p-contact are still under investigation.
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[7] S. Li, et al., Joule, 5, 1535-1547 (2021)
[8] M. Bivour, et al., SiliconPV 2021.
[9] C. Han, et al., ACS Appl. Mater. Interfaces, 11, 45586 (2019)
[10] C. Han, et al., Sol. Energy Mater. Sol. Cells, 227, 111082 (2021)