John Sudijono

Presentation History

2024 MRS Spring Meeting

Interconnect Technologies in The Ultrathin Limit: Performance of Standard and 2D Barriers and Liners in The Nanometer Thickness Regime

Apr 25, 2024, 11:00 AM

2024 MRS Spring Meeting

Atomic Layer Deposition of WS₂ on Low-k Dielectric Substrates for Back-End-Of-Line Integration

Apr 24, 2024, 9:00 AM

2023 MRS Spring Meeting

Atomic Layer Deposition of Conformal Wafer-scale WS₂ Films: a Promising Liner and Barrier Alternative for Back-end-of-Line Applications

Apr 13, 2023, 11:15 AM

2022 MRS Spring Meeting

Scalable Back-End-of-Line Compatible Growth of WS₂ Thin Films via Atomic Layer Deposition

May 8, 2022, 3:15 PM