Pushing the Limits of Dielectric-based Microchannel Cooling using Encapsulated Phase Change Material Slurries

Apr 9, 2025
5:00pm - 7:00pm

Summit, Level 2, Flex Hall C

Vivek Manepalli

Roshith Mittakolu

Akshaya Sridhar

Vivek Pandey

Clayton Pullins

Michael Barako

Damena Agonafer

Vivek Manepalli¹,Roshith Mittakolu¹,Akshaya Sridhar¹,Vivek Pandey¹,Clayton Pullins²,Michael Barako²,Damena Agonafer¹

University of Maryland College Park¹,Northrop Grumman Corporation²

Yee Kan Koh, National University of Singapore

Zhiting Tian, Cornell University

Tianli Feng, University of Utah

Hyejin Jang, Seoul National University

Tianli Feng

Yee Kan Koh