Interfacing Durable Materials to Enable Structural Electronics

In-mold structural electronics (IMSE) is a manufacturing approach to integrate devices into any architectural form factor, providing design freedom and device simplification while delivering advantageous size, weight and power. IMSE typically links integrated circuits and discretes by screen-printing nanoparticle-based inks onto flat, thermoplastic substrates that are molded into 3D forms—material sets/processes with widely variable interfaces that are woefully suited for demanding environmental applications. Our project seeks to demonstrate the application of more robust and reliable materials, compatible in extreme environments, such as metal foils for circuit patterning and moldable thermosets. We have explored patterning of copper foils onto b-staged and dual cure epoxies that are subsequently formed into test coupons to study interface delamination, encapsulation and environmental stability. Additionally, we have adapted the chemistry of frontal ring-opening metathesis polymerization (FROMP) of dicyclopentadiene (DCPD), a rugged thermoset material, to be compatible with IMSE. Foil patterned pre-forms are vacuum molded into devices such as 3D RF circuits, battery interconnects, and capacitive touch panels that are subsequently locked into shape at ambient temperature using FROMP. This represents a breakthrough for IMSE technologies, enabling 3D device integration into challenging environmental architectures.