April 22 - 26, 2024
Seattle, Washington
May 7 - 9, 2024 (Virtual)

Event Supporters

2024 MRS Spring Meeting
EN08.08.07

Alloying-Induced Structural Transition in The Promising Thermoelectric Compound CaAgSb

When and Where

Apr 24, 2024
5:00pm - 7:00pm
Flex Hall C, Level 2, Summit

Presenter(s)

Co-Author(s)

Alexandra Zevalkink1,A K M Ashiquzzaman Shawon1,Weeam Guetari1,Kamil Ciesielski2,Rachel Orenstein2,Jiaxing Qu3,Elif Ertekin3,Eric Toberer2

Michigan State University1,Colorado School of Mines2,University of Illinois at Urbana-Champaign3

Abstract

Alexandra Zevalkink1,A K M Ashiquzzaman Shawon1,Weeam Guetari1,Kamil Ciesielski2,Rachel Orenstein2,Jiaxing Qu3,Elif Ertekin3,Eric Toberer2

Michigan State University1,Colorado School of Mines2,University of Illinois at Urbana-Champaign3
<i>AMX</i> Zintl compounds, crystallizing in several closely related layered structures, have recently garnered attention due to their exciting thermoelectric properties. In this study, we show that the orthorhombic CaAgSb can be alloyed with hexagonal CaAgBi to achieve a solid solution with a structural transformation at <i>x</i> ~ 0.8. This transition can be seen as a switch from 3D to 2D covalent bonding, in which the interlayer <i>M-X</i> bond distances expand while the in-plane <i>M-X</i> distances contract. Measurements of the elastic moduli reveal that CaAgSb<sub>1-x</sub>Bi<sub>x</sub> becomes softer with increasing Bi content, with the exception of a step-like 10% stiffening observed at the 3D-to-2D phase transition. Thermoelectric transport measurements reveal promising Hall mobility and a peak <i>zT</i> of 0.47 at 620 K for intrinsic CaAgSb, which is higher than previous reports for unmodified CaAgSb. However, alloying with Bi was found to increase the hole concentration beyond the optimal value, effectively lowering the <i>zT</i>. Interestingly, analysis of the thermal conductivity and electrical conductivity suggests that the Bi-rich alloys are low Lorenz-number (<i>L</i>) materials, with estimated values of <i>L</i> well below the non-degenerate limit of <i>L</i> = 1.5 x 10<sup>-8</sup> W.Ω.K<sup>-2</sup>, in spite of the metallic-like transport properties. A low Lorenz number decouples electrical and electronic thermal conductivity, providing greater flexibility for enhancing thermoelectric properties.

Keywords

thermal conductivity | thermoelectricity | x-ray diffraction (XRD)

Symposium Organizers

Ernst Bauer, Vienna Univ of Technology
Jan-Willem Bos, University of St. Andrews
Marisol Martin-Gonzalez, Inst de Micro y Nanotecnologia
Alexandra Zevalkink, Michigan State University

Session Chairs

Jan-Willem Bos
Alexandra Zevalkink

In this Session