April 22 - 26, 2024
Seattle, Washington
May 7 - 9, 2024 (Virtual)
Symposium Supporters
2024 MRS Spring Meeting & Exhibit
SB11.07.07

A Self-Healing Electrically Conductive Organogel Composite

When and Where

Apr 24, 2024
5:00pm - 7:00pm
Flex Hall C, Level 2, Summit

Presenter(s)

Co-Author(s)

Yongyi Zhao1,2,Carmel Majidi1

Carnegie Mellon University1,Massachusetts Institute of Technology2

Abstract

Yongyi Zhao1,2,Carmel Majidi1

Carnegie Mellon University1,Massachusetts Institute of Technology2
Self-healing hydrogels use spontaneous intermolecular forces to recover from physical damage caused by extreme strain, pressure or tearing. Such materials are of potential use in soft robotics and tissue engineering, but they have relatively low electrical conductivity, which limits their application in stretchable and mechanically robust circuits. Here we report an organogel composite that is based on poly(vinyl alcohol)–sodium borate and has high electrical conductivity (7 × 10<sup>4</sup> S m<sup>−1</sup>), low stiffness (Young’s modulus of ~20 kPa), high stretchability (strain limit of &gt;400%) and spontaneous mechanical and electrical self-healing. The organogel matrix is embedded with silver microflakes and gallium-based liquid metal microdroplets, which form a percolating network, leading to high electrical conductivity in the material. We also overcome the rapid drying problem of the hydrogel material system by replacing water with an organic solvent (ethylene glycol), which avoids dehydration and property changes for over 24 h in an ambient environment. We illustrate the capabilities of the self-healing organogel composite by using it in a soft robot, a soft circuit and a reconfigurable bioelectrode.

Symposium Organizers

Artur Braun, Empa
Minkyu Kim, The University of Arizona
Danielle Mai, Stanford University
Newayemedhin Tegegne, Addis Ababa University

Session Chairs

Minkyu Kim
Danielle Mai

In this Session