Scale up of High Temperature Polyimide and Polyolefin Dielectrics, Film Processing and Testing

Dielectric polymers used in electrical and electronic systems require withstanding high electric field and elevated temperature. o-polyoxachloronorbornene (o-POClNB) and polyetherimide (PEI) are two such polymers chosen for scaling up as they have demonstrated excellent dielectric performance at high electric field and high temperature (between 150°C to 200°C) operating range. These polymers have also high enough molecular weight to be able to make entanglements in polymer chains. Polymer samples were used for mechanical testing and solution processing for film casting. The large-scale polymer films would undergo further extensive dielectric testing. The o-POClNB Thermal, mechanical and dielectric properties of these polymers showed the possible melt processibility when synthesized at a larger scale. Scaling up of these polymers would help in understanding cost, evaluation of morphology and structure property relationship with dielectric and thermal properties for high energy density capacitors and other energy storage devices. Replacement of biaxially oriented polypropylene (BOPP) for capacitor application is very important especially at operational temperature above 100°C with potential impacts over broad range of NAVY applications in pulse power and marine electronics.