Dec 5, 2024
11:30am - 11:45am
Hynes, Level 1, Room 107
Aleksandar Radic1,Sam Lambrick1,Nick von Jeinsen1,Ismail Sami1,Yiru Zhu1,Vivian Perez1,Andrew Jardine1,Manish Chhowalla1
University of Cambridge1
Aleksandar Radic1,Sam Lambrick1,Nick von Jeinsen1,Ismail Sami1,Yiru Zhu1,Vivian Perez1,Andrew Jardine1,Manish Chhowalla1
University of Cambridge1
Sulphur vacancy defects mediate a wide range of optoelectronic properties in MoS2, with precise control of defect density allowing for tuneable optoelectronic devices. However, accurate measurement of defect density in monolayer and few-layer samples poses a challenge due to their small scattering cross-sections to photon or electron probes.Conventional lab-based techniques such as Raman and photoluminescence can infer approximate defect density in micro-scale samples via optoelectronic properties, but they require calibration using stoichiometric beam-line XPS. We introduce an ultra-low energy (~64 meV), non-damaging, lab-based technique to quantify the surface defect density in micron-scale monolayer MoS2. Here we show that a recently developed technique, scanning helium microscopy (SHeM), can be used to directly measure vacancy-type defect density in 2D materials by performing atom diffraction from a microscopic spot. SHeM uses a neutral, inert, and thermal energy probe of helium-4 atoms to measure ordered and disordered atom-surface scattering allowing the level of surface order to be inferred. The presented method enables rapid, non-damaging, and material-agnostic lab-based quantification of defect density in 2D materials, a crucial step towards the wider adoption of 2D semiconductors in devices.