Enhanced Thermal Conductivity Epoxy Resin via Star-Shaped Crystalline Amine Curing Agents

The semiconductor technologies are escalating, driven by the growing demands for highly improved techniques and multi-functional devices. This advanced semiconductor generates extreme heat, thermal management has become critical for enhancing performance and extending the lifespan. Epoxy resin is commonly used as a thermal dissipation material due to its excellent adhesion properties and mechanical strength, but it has the drawback of low thermal conductivity around 0.2 W/mK. In this study, we designed a novel epoxy resin formulated with a star-shaped crystalline amine curing agent with high thermal conductivity. The unique crystalline structure of the curing agent, characterized by four aromatic rings connected by carboxyl groups, promotes rapid phonon transportation through the bulk and rigid structure. As a result, the pristine epoxy resin cured with this curing agent exhibits about 20% higher thermal conductivity (~0.26 W/mK) than conventional epoxy resin. Moreover, when it is manufactured as composites, our epoxy composites demonstrate a significantly enhanced thermal conductivity, over 50% higher than conventional epoxy composites. In conclusion, this new epoxy resin can handle high temperatures effectively and be adopted as a thermal interface material and encapsulant in next-generation semiconductors.