Dec 5, 2024
3:30pm - 4:00pm
Hynes, Level 1, Room 102
Huanyu Cheng1
The Pennsylvania State University1
Conventional electronics today form on the planar surfaces of brittle wafer substrates and are not compatible with 3D deformable surfaces. As a result, stretchable electronic devices have been developed for continuous health monitoring. Practical applications of the next-generation stretchable electronics hinge on the integration of stretchable sustained power supplies with highly sensitive on-skin sensors and wireless transmission modules. This talk presents the challenges, design strategies, and novel fabrication processes behind a potential standalone stretchable device platform that (a) integrates with 3D curvilinear dynamically changing surfaces, and (b) dissolves completely after its effective operation. The resulting device platform creates application opportunities in fundamental biomedical research, disease diagnostic confirmation, healthy aging, human-machine interface, and smart Internet of Things.