Dec 5, 2024
10:00am - 10:30am
Sheraton, Second Floor, Back Bay C
Saptarshi Das1
The Pennsylvania State University1
In this presentation, I will delve into the exciting realm of monolithic 3D integration, where emerging 2D materials take center stage, empowering advanced memory, logic, and sensing devices. Notably, our recent breakthroughs have culminated in the successful demonstration of wafer-scale 2-tier and 3-tier 3D integration, utilizing MoS<sub>2</sub> and WSe<sub>2</sub> FETs as well as graphene as the building blocks. These achievements have paved the way for multifunctional circuits that hold immense promise for the future of electronics.