April 10 - 14, 2023
San Francisco, California
2023 MRS Spring Meeting
EL18.06.22

Crack Suppression of Cu Interconnect by Twin Engineering for Improving Reliability of Flexible Devices

When and Where

Apr 11, 2023
5:00pm - 7:00pm
Moscone West, Level 1, Exhibit Hall

Presenter(s)

Co-Author(s)

Seongi Lee1,Jun-Hyeok Hyun2,Sang-Ha Shin2,Eun-Jung Kim2,Youngchang Joo1,So-Yeon Lee2

Seoul National University1,Kumoh institute of Technology2

Keywords

Cu | fatigue | thin film

Symposium Organizers

Ho-Hsiu Chou, National Tsing Hua University
Francisco Molina-Lopez, KU Leuven
Sihong Wang, University of Chicago
Xuzhou Yan, Shanghai Jiao Tong University

Symposium Support

Bronze
Azalea Vision
MilliporeSigma
Device, Cell Press

Session Chairs

Ho-Hsiu Chou
Francisco Molina-Lopez
Sihong Wang

In this Session