High-Temperature Elastic Moduli—A Tool for Understanding Chemical Bonding and Thermal Transport in Thermoelectric Materials

Nov 29, 2022
1:30pm - 2:00pm

Sheraton, 2nd Floor, Back Bay A

Alexandra Zevalkink¹

Michigan State University¹

defects | thermal conductivity | thermoelectricity

Sepideh Akhbarifar, The Catholic University of America

Guangzhao Qin, Hunan University

Heng Wang, Illinois Institute of Technology

Sarah J. Watzman, University of Cincinnati

Gold
National Science Foundation

Ali Shakouri

G. Snyder