Precision Interface Engineering by ALD in CuNi Alloys Towards High Thermoelectric Performance

Nov 29, 2022
2:45pm - 3:00pm

Sheraton, 2nd Floor, Back Bay A

Shiyang He

Amin Bahrami

Shiyang He¹,Amin Bahrami¹,Kornelius Nielsch¹

Leibniz Institute of Solid State and Materials Science¹

alloy | atomic layer deposition | grain boundaries

Sepideh Akhbarifar, The Catholic University of America

Guangzhao Qin, Hunan University

Heng Wang, Illinois Institute of Technology

Sarah J. Watzman, University of Cincinnati

Gold
National Science Foundation

Ali Shakouri

G. Snyder