April 17 - 23, 2021
April 17 - 23, 2021 (Virtual)
2021 MRS Spring Meeting
EL04.10.02
Removal of Mechanical Polishing-Induced Nanoscale Damage in Diamond by Chemical Mechanical Polishing (CMP)
When and Where
Apr 20, 2021
8:25am - 8:40am
8:25am - 8:40am
EL04
Presenter(s)
Co-Author(s)
Koji Koyama1,2,Naoki Fujita1,Seong-Woo Kim1,Mamoru Yoshimoto2
Adamant Namiki Precision Jewel Co., Ltd.1,Tokyo Institute of Technology2
Keywords
defects | machining | morphology
Symposium Organizers
Hongping Zhao, The Ohio State University
Masataka Higashiwaki, National Institute of Information & Comm Tech
Robert Kaplar, Sandia National Laboratories
Julien Pernot, University of Grenoble
Symposium Support
Silver
Taiyo Nippon Sanso
Taiyo Nippon Sanso
Session Chairs
Robert Nemanich
Julien Pernot