Oxide-Free Copper Nanoparticle Incorporated Gallium-Based Liquid Metal Alloy for High-Performance Thermal Interface Materials

Dec 7, 2021
7:00pm - 7:15pm

EN10-Virtual

Seokkan Ki

Jaehwan Shim

Seungtae Oh

Jaechoon Kim

Youngsuk Nam

Seokkan Ki^1,2,Jaehwan Shim^1,2,Seungtae Oh¹,Seunggeol Ryu³,Jaechoon Kim³,Youngsuk Nam²

Kyung Hee University¹,Korea Advanced Institute of Science and Technology²,Samsung Electronics Co., Ltd³

composite | Ga | thermal conductivity

Yangying Zhu, University of California, Santa Barbara

Youngsuk Nam, Korea Advanced Institute of Science and Technology

Yuan Yang, Columbia University

Mona Zebarjadi, University of Virginia

Youngsuk Nam

Yangying Zhu