Dec 2, 2019
8:00pm - 10:00pm
Hynes, Level 1, Hall B
Seungki Jo1,Sun Hwa Park2,Seung Hwae Heo1,Jae Sung Son1
Ulsan National Institute of Science and Technology1,Korea Research Institute of Standards and Science2
Seungki Jo1,Sun Hwa Park2,Seung Hwae Heo1,Jae Sung Son1
Ulsan National Institute of Science and Technology1,Korea Research Institute of Standards and Science2
The recent interest in portable and wearable electronics lead flexible thin film thermoelectrics to be regarded as promising candidates for the power supply of self-powered systems. Herein, we report a cost-effective solution process to fabricate flexible Sb<sub>2</sub>Te<sub>3</sub> thermoelectric thin films using molecular Sb<sub>2</sub>Te<sub>3</sub> precursors, synthesized by the reduction of Sb<sub>2</sub>Te<sub>3</sub> powder in ethylenediamine and ethanedithiol with superhydride. This synthetic route decreases the size of the Sb<sub>2</sub>Te<sub>3</sub> precursor to the molecular level, thereby dramatically improving the uniformity and continuity of the thin film. Furthermore, thermally stable FePt nanoparticles are homogeneously embedded in the Sb<sub>2</sub>Te<sub>3</sub> thin film by using the mixed ink solution. The fabricated Sb<sub>2</sub>Te<sub>3</sub> thin films on flexible polyimide substrates exhibit a power factor of of ~8.5 μW cm<sup>-1</sup> K<sup>2</sup> at 423 K. Moreover, such thermoelectric performances of thin films are well preserved during 1000 bending cycles. The current study offers considerable potential for a cost-effective manufacturing for high-performance flexible thin film devices.