April 2 - 6, 2018
Phoenix, Arizona
2018 MRS Spring Meeting
EP01.03.30
The Effect of Leveler on the Via Filling Performance in Copper Electroplating—A Case Study of Functional Groups
When and Where
Apr 3, 2018
5:00pm - 7:00pm
5:00pm - 7:00pm
PCC North, 300 Level, Exhibit Hall C-E
Presenter(s)
Co-Author(s)
SangHoon Jin1,Sung-Min Kim1,Yugeun Jo1,Woon Young Lee1,Min Hyung Lee1
Korea Institute of Industrial Technology1
Keywords
Cu | plating
Symposium Organizers
John Robertson, Cambridge University
Jesus del Alamo, Massachusetts Institute of Technology
Andrew Kummel, University of California, San Diego
Masaaki Niwa, Tohoku University
Symposium Support
MRS Invitation to Publish
All authors are invited to submit articles based on their 2018 MRS Spring
Meeting presentations to journals in the MRS portfolio.
(www.mrs.org/publications-news) Papers submitted and accepted for
publication in MRS Advances (www.mrs.org/mrs-advances) will be
available as symposium collections. Visit the MRS/Cambridge University
Press Publications Booth #100 in the Exhibit Hall to learn more, including
MRS Advances print options available at special rates during the meeting
week only.
All authors are invited to submit articles based on their 2018 MRS Spring
Meeting presentations to journals in the MRS portfolio.
(www.mrs.org/publications-news) Papers submitted and accepted for
publication in MRS Advances (www.mrs.org/mrs-advances) will be
available as symposium collections. Visit the MRS/Cambridge University
Press Publications Booth #100 in the Exhibit Hall to learn more, including
MRS Advances print options available at special rates during the meeting
week only.
Session Chairs
Andrew Kummel
John Robertson