Tutorial TP02—Thermal Characterization of Materials and Devices

1:30 pm
Thermal Characterization of Wide Bandgap Semiconductor Materials and Device
Samuel Graham

The development of wide bandgap semiconductors have enabled new optoelectronic, RF and power electronic devices and their performance and reliability are strongly coupled to their thermal behavior.  In this tutorial, a number of optical and electrical methods will be reviewed which allow for the characterization of the thermal properties of wide bandgap materials including thermal conductivity and thermal interface resistance at contacts.  In addition, metrology methods for mapping temperature under steady-state and high speed thermal transients relevant to RF operation will be discussed along with their limitations and areas which remain a challenge to researchers.

3:00 pm BREAK

3:30 pm
Challenges in Measuring Nano- to Micro-gram Samples: Scanning Calorimetry and Thermoviscoelasticity
Gregory B. McKenna

Novel developments in making ultra-stable glasses lead to measurement challenges because extremely small amounts (nano- to micro-grams) of material are produced. We will describe work using chip calorimetry to determine the thermal properties and the cooling rate dependence of the Tg.  In addition, nano-scale rheology on these materials can be carried out to determine material dynamics using a novel bubble inflation measurement method developed in our labs.

Instructors

• Samuel Graham, Georgia Institute of Technology
• Gregory B. McKenna, Texas Tech University