Directed Self-Assembly (DSA) of polymers or non-polymer materials represents a paradigm shift in materials patterning, offering a pathway to the scalable and cost-effective creation of nanoscale features essential for the next-generation semiconductor and various non-semiconductor applications. This session is designed to explore the recent advancement of DSA technology, from its fundamental principles to its practical applications, seeking to integrate fundamental scientific principles and insights with real-world implementation across various industrial domains. The symposium also aims to foster interdisciplinary collaborations and inspire new directions in the DSA field by combining the expertise of DSA from various research backgrounds.

In this session, discussions will span a wide range of topics in DSA, including the fundamental principles and significant advancements in DSA methodologies, the directed assembly of both polymer and non-polymeric materials, and the cutting-edge materials design, synthesis, and eco-friendly approaches tailored for DSA. The wide-ranging applications of DSA in enhancing electronic devices, energy, and photonic systems will be highlighted, as well as its potential as a complementary technique to Extreme Ultraviolet Lithography (EUVL). The session also focuses on the computational modeling, machine learning, and simulations integral to optimizing DSA processes alongside advanced characterization techniques and pattern transfer strategies. This session highly focuses on the current state-of-the-art technologies, significant challenges, and the perspective for future developments in DSA research, which is highly relevant to materials science and nanotechnology.

infiltration (assembly) nanostructure self-assembly thin film