Symposium EL19-Advanced Materials in Scalable Miniaturized Technologies for Future Electronics

Over the last two decades, the advanced materials landscape has made remarkable progress in terms of novel materials and functionalities, promising potentially faster, more efficient computing and its ultimate integration with a plethora of functionalities (sensing, energy, photonics, etc) into an ever -smaller package to provide almost seamless human-technology integration capabilities. In addition, progress in the area of novel nano(structured) materials (2D materials, nanowires, metamaterials) has also been matched by novel advanced synthesis and patterning processes (from 3D printing to atom -based processes), in parallel to the further development of new computing paradigms such as quantum and neuromorphic approaches.The R&D cycle that can bring novel functional materials from discovery to a successful implementation in silicon technologies can last more than a decade. The time is thus ripe to focus on bridging the requirements that will enable these new materials and techniques to bring unprecedented capabilities to the new computing and integration paradigms. In collaboration with the IEEE Electron Devices Society, the emphasis of our Symposium will be on bridging the R&D gap in electronic materials from lab discovery to implementation in semiconductor devices. Focus is hence on the on the applied aspects of electronic materials, as opposed to fundamental discoveries, and will cover areas from computing devices to interconnects and advanced packaging. Materials will include advanced thin-films as well as nanomaterials (nanowires, nanotubes, 2D materials and their combination). Manufacturing platforms will include wafer -level, roll-to-roll as well as direct-write and additive technologies. Aspects of interest include advances in scalability, large-scale structuring and patterning, robustness and control of interfaces, integrated performance and reliability, and related novel metrics, all while keeping an eye out for long-term sustainability of a large-scale deployment in semiconductor manufacturing.

Topics will include:

Nanometer -scale devices for computing, memory and their interconnects
Integration and large-scale deployment aspects of advanced materials technologies for More than Moore, beyond CMOS and additional integrated functionalities, including flexible electronics
MEMS, photovoltaics, wearables, nearables, IoT sensor nodes
Large -scale manufacturing, including wafer -scale, and roll-to-roll
Material integration processes and strategies, from monolithic to heterogeneous and package -level
Direct-write and additive manufacturing technologies for electronics
Novel electrical, physical and mechanical characterisation methods and metrics for integrated materials and their interfaces
Material scalability, quality & reliability metrics
Sustainability, particularly sourcing, processing and recycling aspects in view of large -scale deployment

Invited Speakers:

Inge Asselberghs (imec, Belgium)
Ageeth Bol (University of Michigan, USA)
Ricardo Donaton (IBM Research, USA)
Mark Eriksson (University of Wisconsin–Madison, USA)
Paolo Gargini (IEEE International Roadmap for Devices and Systems, USA)
Christine Hau-Riege (Qualcomm, USA)
Andriy Hikavyy (imec, Belgium)
Sean King (Intel, USA)
Mario Lanza (King Abdullah University of Science and Technology, Saudi Arabia)
Benji Maruyama (Air Force Research Laboratory, USA)
Masaaki Niwa (The University of Tokyo, Japan)
Marko Radosavljevic (Intel, USA)
Joan Redwing (The Pennsylvania State University, USA)
TY Tseng (National Chiao Tung University, Taiwan)
William Vandenberghe (The University of Texas at Dallas, USA)
Philip Wong (Stanford University, USA)
Yang Yang (University of Technology Sydney, Australia)
Cezar Zota (IBM Research-Zurich)
Ehrenfried Zschech (deepXscan GmbH, Germany)