New computing techniques, supported by emerging materials and devices, are changing the way information is processed. Innovations in operating speed, functional density, and power draw are progressing rapidly. Highly energy efficient intelligence to distributed sensors, imperceptible wearables and transient electronics would enable a fully connected world beyond the current IoT vision. However, this requires concerted advances at every level, from low thermal budget materials with competitive performance and interface engineering to modelling and system design. This symposium will address the multifaceted progress toward these goals via advances in materials, processes, simulation tools, devices, and systems. Discussion of fundamental material science; synthesis, growth mechanisms, fabrication routes and methods to improve important properties are encouraged.
The translation to large scale manufacturing brings additional challenges: cost-effective scale-up, reliability, uniformity and yield rely simultaneously on process control, fundamental material considerations and judicious device engineering. Successful integration with mature technologies continues to be a priority. Key is facilitating a rapid transition from basic science to practical deployment across the broad range of emerging applications including IoT and edge computing. To this end, solutions that cross traditional boundaries are being sought.
A third, strongly budding element is the focus on sustainability for electronic devices and systems, both in the ecological and economical dimensions. Complementing the efforts to reduce e-waste and the reliance on harmful products, such advances are increasingly favoured. Contributions are encouraged on ecological materials and on techniques with reduced manufacturing energy.

electrical properties