Symposium SB04—Advanced Soft Materials for Bioelectronic Interfaces

Bioelectronic interfaces, which facilitate the transduction of biological signals and the stimulation of biological organs/tissues, open new opportunities for various applications such as healthcare, robotics, sports, and e-games. These devices often require the conformal attachment of devices on the curvilinear human skin or organ surface and the long-term operational reliability even under severe mechanical deformation. For these purposes, many researchers have been searching for specialized constituent materials, particularly, targeting stretchable/flexible/soft conductors, semiconductors, and dielectrics, in conjunction with processing/integration methods toward robust high-performance devices.

This symposium covers the recent progress in advanced soft materials, processing, and device architectures for bio-electronic interfaces in the fields of healthcare, robotics, sports, and Internet of Things (IoTs), etc.

• Flexible and/or stretchable active/passive materials for bioelectronics
• Conductive hydrogel materials
• Self-healing, biocompatible, and biodegradable soft electronic materials
• Soft conductive materials for 3D printing
• Soft organic, inorganic, or hybrid materials with capacitive, piezoelectric, piezoresistive, triboelectric, and/or ferroelectric properties
• Stimuli (e.g., stress, light, heat, pH, chemical, etc.)-responsive soft materials
• Soft electronic materials for biochemical sensing
• Soft electronic materials for electrocardiogram (ECG or EKG), electroencephalogram (EEG), electromyogram (EMG), and electrooculogram (EOG)
• Novel electronic materials for brain-machine interfaces
• Novel stretchable and/or flexible device architectures for practical applications in the fields of healthcare, robotics, sports, IoTs, etc.
• Soft energy harvesting materials for bioelectronics

• Polina Anikeeva (Massachusetts Institute of Technology, USA)
• Chris Bettinger (Carnegie Mellon University, USA)
• Mary Donahue (Linköping University, Sweden)
• Kenjiro Fukuda (RIKEN, Japan)
• Wei Gao (California Institute of Technology, USA)
• Anna Herland (KTH Royal Institute of Technology, Sweden)
• Suk-Won Hwang (Korea University, Republic of Korea)
• Ali Javey (University of California, Berkeley, USA)
• Unyong Jeong (Pohang University of Science and Technology, Republic of Korea)
• Pawan Jolly (Harvard University, USA)
• Martin Kaltenbrunner (Johannes Kepler Universität Linz, Austria)
• Shana Kelley (University of Toronto, Canada)
• Dae-Hyeong Kim (Seoul National University, Republic of Korea)
• Sang-Woo Kim (Sungkyunkwan University, Republic of Korea)
• Hyunjoo Lee (Korea Advanced Institute of Science and Technology, Republic of Korea)
• Wei Lin Leong (Nanyang Technological University, Singapore)
• Christian Müller (Chalmers University of Technology, Sweden)
• Clara Santato (Polytechnique Montréal, Canada)
• Thomas Stieglitz (Universität Freiburg, Germany)
• Jeong-Yun Sun (Seoul National University, Republic of Korea)
• Benjamin Tee (National University of Singapore, Singapore)
• Jadranka Travas-Sejdic (University of Auckland, New Zealand)
• Sheng Xu (University of California, San Diego, USA)