Symposium MF03—Materials and Methods for Fabricating Flexible and Large-Area Electronics

The next generation of electronics is dependent on new materials and methods that can reach beyond the capabilities of rigid, silicon-based technologies. Many new and promising applications are emerging that necessitate electronic materials of novel form factors and processing. Specifically, flexible and large-area electronic systems have the potential to impact many industries. For example, foldable displays could benefit from flexible transistor backplanes, thin-film photovoltaics could benefit from large-area fabrication schemes, and multifunctional wearable sensors could benefit from expanded functionality and resilient stretching behavior. There has been extensive research into new materials and fabrication methods that enable the efficient production of these novel form-factor electronics. To facilitate important discussion and dissemination of new results, this symposium will include three broad themes correlated with the advancement of flexible and large-area electronic systems. The primary themes include: (1) the synthesis of materials or material systems that enable inherent resilience to strain, solution processability, or biocompatibility; (2) methods of depositing materials (including printing) to enable flexible or large-area devices; and (3) novel flexible/large-area devices and systems with applications in sensing, energy generation, or communication. Additionally, work that exists as a combination of all the relevant topics is specifically encouraged.

Topics will include:

Development of electronic inks
Techniques for printing electronic materials
Stretchable electronics
Electronic skin
Wearable devices and sensors
Nanomaterial-based thin films
Printed thin-film transistors
Devices enabled by printed electronics
Flexible electronic devices and sensors
Large-area electronic devices and sensors
Advanced manufacturing techniques for large-area electronics
Solution-phase processing of electronic materials
Interfaces and transport properties in thin-film electronic devices/sensors

Invited Speakers:

Jong-Hyun Ahn (Yonsei University, Republic of Korea)
Deji Akinwande (The University of Texas at Austin, USA)
Trisha Andrew (University of Massachusetts at Amherst, USA)
Stephen Forrest (University of Michigan, USA)
Elvira Fortunato (Universidade Nova de Lisboa, Portugal)
Daniel Frisbie (University of Minnesota, USA)
Mark Hersam (Northwestern University, USA)
Hideo Hosono (Tokyo Institute of Technology, Japan)
Muhammad Hussain (King Abdullah University of Science and Technology, Saudi Arabia)
Chang Kyu Jeong (Jeonbuk National University, Republic of Korea)
Oana Jurchescu (Wake Forest University, USA)
John Kymissis (Columbia University, USA)
Vincenzo Pecunia (Soochow University, China)
Becky Peterson (University of Michigan, USA)
Luisa Torsi (Università degli Studi di Bari Aldo Moro, Italy)
Jana Zaumseil (Universität Heidelberg, Germany)