December 1 - 6, 2019
Boston, Massachusetts
2019 MRS Fall Meeting

Symposium FF05-Advanced Atomic Layer Deposition and Chemical Vapor Deposition Techniques and Applications

Research on chemical vapour deposition (CVD) and atomic layer deposition (ALD), which is a surface-limited and self-terminating version of CVD, has expanded in new directions in recent years. A much wider range of materials can now be deposited by these techniques, including metals, organic materials, hybrid materials, complex oxides, and doped oxides. This has followed from the development of novel precursors and the integration of plasma sources, as well as the modelling and simulation of reaction mechanisms, for which new in-situ characterization tools have provided additional insight. CVD and ALD were originally used for depositing uniform films, but patterning has become possible through area-selective deposition methods. CVD and ALD have also been adapted for higher throughput and atmospheric operation, including approaches based on the spatial separation of precursors (e.g., spatial ALD). The expanded capabilities of ALD and CVD have resulted in the use of these techniques in a much wider range of applications, including energy storage, catalysis, photovoltaics, LEDs, and sensing, among others. Notably, the ALD and CVD materials often act as enabling components in these applications. This symposium will bring together ALD and CVD researchers, who are often dispersed amongst different symposia at materials-focused conferences, to highlight and discuss recent advancements in the field of ALD and CVD and the technologies they are enabling.

Topics will include:

  • New ALD/CVD precursors and reaction mechanisms
  • Simulation and modelling of reaction mechanisms
  • Deposition of organic and hybrid materials
  • Deposition of 2D materials, sulphides, nitrides
  • Energy activated ALD/CVD
  • Area-Selective ALD/CVD
  • Advanced ALD/CVD equipment and characterization techniques
  • Spatial ALD, atmospheric processing, and high throughput
  • Devices and applications enabled by ALD/CVD

Invited Speakers:

  • Sven Van Elshocht (imec, Belgium)
  • Robert Hoye (University of Cambridge, United Kingdom)
  • David Bergsman (Massachusetts Institute of Technology, USA)
  • Maarit Karppinen (Aalto University, Finland)
  • Mato Knez (CIC nanoGUNE, Spain)
  • Sean Barry (Carleton University, Canada)
  • Elisabeth Blanquet (CNRS SIMAP, France)
  • Anna Coclite (TU Graz, Austria)
  • Simon Elliott (Schrodinger, USA)
  • Steve George (University of Colorado, USA)
  • Malancha Gupta (University of Southern California, USA)
  • Sung Gap Im (KAIST, Republic of Korea)
  • Kenneth Lau (Drexel University, USA)
  • Graziella Malandrino (Universitá degli Studi di Catania, Italy)
  • Greg Randall (General Atomics, USA)
  • Wyatt Tenhaeff (University of Rochester, USA)
  • Ralf Tonner (Philipps University Marburg, Germany)

Symposium Organizers

Kevin Musselman
University of Waterloo
Mechanical and Mechatronics Engineering
Canada

Stacey Bent
Stanford University
USA

Karen Gleason
Massachusetts Institute of Technology
USA

David Muñoz-Rojas
Université Grenoble Alpes

 

France

Topics

atomic layer deposition chemical vapor deposition (CVD) (deposition) film plasma-enhanced CVD (PECVD) (deposition) simulation surface chemistry