Research on chemical vapour deposition (CVD) and atomic layer deposition (ALD), which is a surface-limited and self-terminating version of CVD, has expanded in new directions in recent years. A much wider range of materials can now be deposited by these techniques, including metals, organic materials, hybrid materials, complex oxides, and doped oxides. This has followed from the development of novel precursors and the integration of plasma sources, as well as the modelling and simulation of reaction mechanisms, for which new in-situ characterization tools have provided additional insight. CVD and ALD were originally used for depositing uniform films, but patterning has become possible through area-selective deposition methods. CVD and ALD have also been adapted for higher throughput and atmospheric operation, including approaches based on the spatial separation of precursors (e.g., spatial ALD). The expanded capabilities of ALD and CVD have resulted in the use of these techniques in a much wider range of applications, including energy storage, catalysis, photovoltaics, LEDs, and sensing, among others. Notably, the ALD and CVD materials often act as enabling components in these applications. This symposium will bring together ALD and CVD researchers, who are often dispersed amongst different symposia at materials-focused conferences, to highlight and discuss recent advancements in the field of ALD and CVD and the technologies they are enabling.

atomic layer deposition chemical vapor deposition (CVD) (deposition) film plasma-enhanced CVD (PECVD) (deposition) simulation surface chemistry