Symposium MD10-Micro-Assembly Technologies

The integration of high-performance microscale materials and devices onto non-native substrates enables new kinds of heterogeneous material systems with desirable architectures and functionalities that are inaccessible by conventional means. Micro assembly technologies are the practical ways to make such microscale heterogeneous combinations possible. The aim of this symposium is to address the state-of-the-art and challenges of micro assembly technologies available in diverse research fields including but not limited to robotics, 3D super-chips, system-in-package (SiP), 3D MEMS, and flexible/wearable electronics. Microassembly enables 3D microsystem assembly/packaging and heterogeneous material integration with a variety of strategies depending on different size scales from millimeters to micrometers or even smaller. Challenges in the current micro assembly technologies encompass the scalable assembly with high precision and high throughput, the efficient interconnection of assembled devices, and the enhanced interfacial properties between heterogeneous materials to ensure not only strong mechanical bonding but also desired electrical, thermal or optical contact. This symposium brings the researchers from different research fields such as robotics/automation, LSI, MEMS, and flexible/wearable electronics to bridge the gap between different sectors and to share the current trends, challenges, and future directions in micro assembly technologies.

Topics will include:

Fluidic micro assembly
Laser-assisted transfer processes
Robotic micro assembly
Self-assembly and self-folding
Transfer printing using elastomers or other polymers
Novel interconnections of micro assembled devices
Application and devices enabled by micro assembly
Electric or magnetic field-assisted transfer or assembly processes
Novel materials and materials combinations created by micro assembly

Invited Speakers:

MD10_Micro-Assembly Technologies _0 (University of Washington, USA)
MD10_Micro-Assembly Technologies _1 (University of Illinois at Urbana-Champaign, USA)
MD10_Micro-Assembly Technologies _2 (Femto-St, France)
MD10_Micro-Assembly Technologies _3 (Sumitomo Bakelite Co., Ltd., Japan)
MD10_Micro-Assembly Technologies _4 (Yamaha Motor Co., Ltd., Japan)
MD10_Micro-Assembly Technologies _5 (Université libre de Bruxelles, Belgium)
MD10_Micro-Assembly Technologies _6 (Palo Alto Research Center, USA)
MD10_Micro-Assembly Technologies _7 (University of Tokyo, Japan)
MD10_Micro-Assembly Technologies _8 (Max Planck Institute, Germany)
MD10_Micro-Assembly Technologies _9 (Delft University of Technology, Netherlands)
MD10_Micro-Assembly Technologies _10 (NXP Semiconductor, Netherlands)
MD10_Micro-Assembly Technologies _11 (University of Southern California, USA)