Symposium EP12-Materials Frontiers in Semiconductor Advanced Packaging

Moore’s Law has been governing Si-based semiconductor device industry for the last 50 years with great success on continuing to achieve cheaper and better devices. However, as 14/16 nm FinFET technology being developed and adopted into mass production, the industry realized that cost for each transistor goes up instead of down for the first time in nearly half a century. Moreover, device performance is increasingly being dominated by interconnect RC delay instead of gate delay. As a comparison, semiconductor advanced packaging technology has been growing very rapidly in the last 10 years to help realize new functions and better device/system performance with a relatively good cost-to-benefit ratio. New packaging technologies like SiP, FO-WLP, 2.5D Interposer, and 3D TSV have seen dramatic development efforts. There is an industry-wide consensus that advanced packaging technology has become a major driver and differentiator for the industry to continue the quest to getting faster, cheaper, and smaller devices. Put in different words, advanced packaging technology enables the so-called “More-than-Moore” era.

Materials play a critical role in semiconductor advanced packaging technology and have been a central focus for research and development efforts for both the industry and academia. Areas like mobile devices, high-performance computing, MEMS, LED, and auto have all seen major activities. Looking five to ten years out, however, the industry does not have a clear roadmap on advanced packaging materials. This presents a good opportunity to explore frontiers of advanced packaging material research. For example, on the metallization side, low-temperature solder and novel interconnect materials, reliability of various interconnect integration schemes; on the polymer side, thermally conductive underfills, highly efficient thermal interface materials, and TCE matched build-up films. For this symposium, the central theme is to discuss industry challenges and explore material frontiers to satisfy the mid to long term needs of the industry. It is planned to have a good combination of industrial and academic abstracts to try to cover different horizons and timelines, and to promote interactions and collaborations between the two groups.

• Material Reliability in Advanced Packaging
• Thermal Materials in Semiconductor Packaging
• Enabling Materials for High Frequency Substrates
• Materials Challenges in FC CSP/BGA, QFN, WLP, 2.5D interposers, and 3D-TSV
• Flexible, Large area, and Organic Electronics Packaging Materials
• Emerging Materials for Semiconductor Packaging – Biomaterials, Chiral Materials, Optical Materials, 3D Printing,1D and 2D materials etc
• Novel Materials for Automobile Electronics, LED and MEMS Advanced Packaging

• EP12_Materials Frontiers in Semiconductor Advanced Packaging_0 (Fraunhofer IZM, Germany)
• EP12_Materials Frontiers in Semiconductor Advanced Packaging_1 (Yole Développement, France)
• EP12_Materials Frontiers in Semiconductor Advanced Packaging_2 (Qualcomm Technologies, USA)
• EP12_Materials Frontiers in Semiconductor Advanced Packaging_3 (Purdue University, USA)
• EP12_Materials Frontiers in Semiconductor Advanced Packaging_4 (Hong Kong Baptist University, Hong Kong)
• EP12_Materials Frontiers in Semiconductor Advanced Packaging_5 (Stanford University, USA)
• EP12_Materials Frontiers in Semiconductor Advanced Packaging_6 (University of Tokyo, Japan)
• EP12_Materials Frontiers in Semiconductor Advanced Packaging_7 (Osaka University, Japan)
• EP12_Materials Frontiers in Semiconductor Advanced Packaging_8 (SEMI, USA)
• EP12_Materials Frontiers in Semiconductor Advanced Packaging_9 (University of California, Los Angeles, USA)
• EP12_Materials Frontiers in Semiconductor Advanced Packaging_10 (Georgia Institute of Technology, USA)
• EP12_Materials Frontiers in Semiconductor Advanced Packaging_11 (Hitachi Chemical, Japan)
• EP12_Materials Frontiers in Semiconductor Advanced Packaging_12 (Georgia Institute of Technology, USA)
• EP12_Materials Frontiers in Semiconductor Advanced Packaging_13 (Taiwan Semiconductor Manufacturing Company Limited (TSMC), Taiwan)
• EP12_Materials Frontiers in Semiconductor Advanced Packaging_14 (Thales Research and Technology, France)