Apr 11, 2025
4:15pm - 4:30pm
Summit, Level 4, Room 444
Haoxiong Yan1,Jake Rochman1,Zihao Yang1,Ruoyu Li1,Leslie Du1,Mingwei Zhu1,Nag Patibandla1,Rutger Thijssen1,Robert Blum1,Zhebo Chen1,Robert Visser1
Applied Materials, Inc.1
Haoxiong Yan1,Jake Rochman1,Zihao Yang1,Ruoyu Li1,Leslie Du1,Mingwei Zhu1,Nag Patibandla1,Rutger Thijssen1,Robert Blum1,Zhebo Chen1,Robert Visser1
Applied Materials, Inc.1
Quantum processors have made significant strides in scaling up to hundreds and thousands of qubits. However, in order to achieve practical quantum advantage, the number of physical qubits needs to reach the millions. Different types of quantum systems face their own unique challenges. For solid-state qubits such as superconducting qubits and spin qubits, improving qubit quality through materials engineering and integrating large-scale packaging solutions have been key. On the other hand, for atom/ion and optics systems, the use of integrated photonics can facilitate further scalability. In the semiconductor industry, the integration of billions of transistors on a single chip has been achieved through decades of advancements in materials engineering and advanced packaging techniques. In this presentation, we will explore how Applied Materials, a leading provider of materials engineering solutions for the semiconductor industry, plans to leverage modern CMOS technology to enhance and scale up quantum processors.