April 7 - 11, 2025
Seattle, Washington
Symposium Supporters
2025 MRS Spring Meeting & Exhibit
EL05.09.06

Direct Processing by µDALP™—Precision Coatings for Next Gen Devices

When and Where

Apr 11, 2025
2:45pm - 3:00pm
Summit, Level 4, Room 431

Presenter(s)

Co-Author(s)

Mira Baraket1,Masoud Akbari1,Simone Santucci1,Ivan Kundrata1,Maksym Plakhotnyuk1

ATLANT 3D1

Abstract

Mira Baraket1,Masoud Akbari1,Simone Santucci1,Ivan Kundrata1,Maksym Plakhotnyuk1

ATLANT 3D1
Advancements in the microelectronics sector demand the ability to create high-quality films with nanoscale accuracy to pattern complex features on substrates. Area-selective deposition (ASD) meets this demand by enabling the selective formation of films on specific surface regions while preventing deposition elsewhere. Atomic Layer Deposition (ALD), a well-established technique in the semiconductor field, has been widely investigated for ASD applications. However, this method often requires initial surface treatments, surface functionalization, or alterations to the process.
ATLANT 3D has introduced an innovative technology named microreactor Direct Atomic Layer Processing - µDALP™, enabling precise localized thin film deposition with accuracy down to a few hundred microns, incorporating all conventional ALD advantages. This technology leverages a specialized design of micronozzles to spatially separate precursors and reactants, facilitating rapid film deposition at atmospheric conditions. The µDALP™ technology stands out for its vertical atomic monolayer precision, achieving an accuracy of 0.2 nm. It is especially effective for selective patterning across diverse surfaces, including microfluidic channels, optical gratings, and nanostructured interfaces, showcasing its versatility and precision. Moreover, this technology enables fast and cost-effective prototyping of devices, facilitating a level of design creativity and optimization that is challenging with traditional thin film deposition approaches.
ATLANT 3D's technology has been successfully utilized to innovate in fields such as optics and photonics, quantum devices, microelectromechanical systems (MEMS), RF electronics, cutting-edge memory technologies, advanced packaging, and energy storage, showcasing its wide-ranging application potential. In this talk, we will explain the significant contributions of our µDALP™ technology to the evolution and expansion of thin-film manufacturing and discuss the wide applications it offers.

Keywords

additive manufacturing | atomic layer deposition | selective area deposition

Symposium Organizers

Tse Nga Ng, University of California, San Diego
Mujeeb Chaudhry, Durham University
Gerardo Hernandez-Sosa, Karlsruhe Institute of Technology
Wei Lin Leong, Nanyang Technological University

Session Chairs

Cunjiang Yu

In this Session