Apr 9, 2025
5:00pm - 7:00pm
Summit, Level 2, Flex Hall C
Yongki Kim1,Myunghun Shin1,Sunjae Kim2,1,Dae-Woo Jeon2,Ji-Hyeon Park2
Korea Aerospace University1,Korea Institute of Ceramic Engineering and Technology2
Yongki Kim1,Myunghun Shin1,Sunjae Kim2,1,Dae-Woo Jeon2,Ji-Hyeon Park2
Korea Aerospace University1,Korea Institute of Ceramic Engineering and Technology2
This study investigates the performance of ultra-thin α-Ga
2O
3-based metal-semiconductor-metal (MSM) photodetectors. The device features an unintentionally doped α-Ga
2O
3 active layer grown on a sapphire substrate, patterned Ti/Au electrodes, and an SiO
2 passivation layer. We present a cost-effective process for fabricating ultraviolet (UV) photodetectors.
Hydride vapor phase epitaxy (HVPE) was employed to grow the α-Ga
2O
3 layers, offering high efficiency with rapid growth rates, large-area scalability, and cost-effectiveness. This method produces high-quality, uniform crystalline layers, making it ideal for power electronics and UV photonic devices. Unlike the costly homo-epitaxial growth on Ga
2O
3 substrates, the α-Ga
2O
3 active layer was hetero-epitaxially grown on sapphire substrates, demonstrating strong UV C-band absorption (>80%) even with a thin layer.
However, hetero-epitaxial growth can introduce internal and interfacial defects that may impair device performance. To mitigate these issues, a rapid thermal annealing (RTA) process in an oxygen atmosphere was applied. Increased RTA durations significantly enhanced device performance, achieving faster response times and higher responsivity, even with an active layer thickness of just 200 nm.
These findings demonstrate the potential for cost-effective and scalable production of thin α-Ga
2O
3-based UV devices. Furthermore, the RTA process effectively improves thin-film properties, broadening the applicability of heterojunction α-Ga
2O
3 devices for ultraviolet photodetection and other optoelectronic applications.