Customized, Skin-Like Electronics Based on Microdevices

Hybridization of inorganic devices and polymeric environments enables the realization of conformable, skin-like electronics without compromising device-level performance. In terms of strain engineering, reducing the size of inorganic devices effectively minimizes the strain concentrated at soft-rigid boundaries, thereby enhancing mechanical conformability and stability under deformation. In this regard, micro-sized devices integrated into polymeric platforms are particularly advantageous, requiring novel methodologies for soft substrates, interconnects, and integration schemes.
In this talk, we introduce our comprehensive and systematic strategies for realizing customized, skin-like electronics based on microdevices, including customizable soft platform technology and microdevice integration. Leveraging nanocomposite conductive ink, we developed three-dimensional intrinsically stretchable interconnects capable of maintaining high conductivity even under strains over 150%, which broadens the designs possibilities for skin-like electronic circuits¹. Furthermore, we addressed the challenges of reliable integration between microdevices and ultraflexible/stretchable platforms by developing anisotropic conductive adhesive layers based on magnetically self-assembled nanocomposites². These layers can be directly patterned on microdevices, enabling area-confined anisotropic integration that maximizes the mechanical conformability of polymeric substrates.
Through these strategies, we have successfully demonstrated ultraflexible/stretchable micro-LED displays and skin-attachable sensory electronics, which could make significant contributions to the fields of wearable electronics.

1. B. Lee*, H. Cho, Y. Ko, Y.-S. Ryu, H. Kim, J. Jeong, and S. Chung*, Nat. Electron. 6, 307-318 (2023).
2. H. Yoon, S. Jeong, B. Lee*, and Y. Hong*, Nat. Electron. 7, 383-395 (2024).