Monolithic 3D Integration of Complex Oxides for Advanced Electronics

Eliminating the use of wafers in this complex 3D assembly, a.k.a. monolithic 3D (M3D), could streamline the process and reduce the length of data paths. Yet, current technologies scarcely allow for the removal and reassembly of active single-crystalline oxides from wafers. Moreover, directly epitaxial growths onto existing circuits present additional hurdles. Over the last decade, my group at MIT has pioneered epitaxy techniques for advancing wafer-free M3D integration of single-crystalline oxide-based devices. Firstly, I will introduce our innovation in transfer-based M3D integration of single-crystalline complex oxides based on remote epitaxy and other methods. Secondly, I will introduce our recent development of growth-based M3D integration by successfully implementing single-crystalline material growths directly on non-single crystalline surface. This really unlocks the way to seamless monolithic integration for advanced 3D systems.